Datasheet
PIC16C77X
DS30275B-page 152 Advance Information 1999-2013 Microchip Technology Inc.
15.1 DC Characteristics: PIC16C77X (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage V
DD 4.0
4.5
—
—
5.5
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
V
DR —1.5—V
D003 V
DD start voltage to
ensure internal Power-on
Reset signal
VPOR —VSS — V See section on Power-on Reset for details
D004* V
DD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 — — V/ms See section on Power-on Reset for details.
PWRT enabled
D010
D013
Supply Current (Note 2) I
DD —
—
2.7
13.5
5
30
mA
mA
XT, RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
F
OSC = 20 MHz, VDD = 5.5V
D020
D020A
Power-down Current
(Note 3)
I
PD —
—
1.5
1.5
16
19
A
A
VDD = 4.0V, -0C to +70C
V
DD = 4.0V, -40C to +85C
Module Differential Cur-
rent (Note 5)
D021 Watchdog Timer I
WDT —6.020AVDD = 4.0V
D023*
D023B*
Brown-out Reset Current
(Note 5)
Bandgap voltage
generator
I
BOR
IBG
6
TBD
—
200
40A
—
TBD
A
A
BOR enabled, VDD = 5.0V
D025* Timer1 oscillator I
T1OSC —59AVDD = 4.0V
D026* A/D Converter I
AD — 300 — AVDD = 5.5V, A/D on, not converting
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: The current is the additional current consumed when the peripheral is enabled. This current should be
added to the base (I
PD or IDD) current.
6: The bandgap voltate reference provides 1.22V to the VRL, VRH, LVD and BOR circuits. When calculating cur-
rent consumption use the following formula: I
VRL + IVRH + ILVD + IBOR + IBG. Any of the IVRL, IVRH,
I
LVD or IBOR can be 0.
774.book Page 152 Tuesday, January 29, 2013 12:02 PM