Datasheet

 1999-2013 Microchip Technology Inc. Preliminary DS41124D-page 151
PIC16C745/765
28-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
7.497.246.99.295.285.275
U
Lid Width
12.9512.7012.45.510.500.490TLid Length
4.344.224.09.171.166.161WWindow Diameter
8.237.877.52.324.310.296eBOverall Row Spacing §
0.510.460.41.020.018.016BLower Lead Width
1.321.271.22.052.050.048B1Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.813.563.30.150.140.130LTip to Seating Plane
35.9235.5635.201.4141.4001.386DOverall Length
7.627.377.11.300.290.280
E1
Package Width
1.521.271.02.060.050.040A1Standoff
3.943.432.92.155.135.115A2Top of Body to Seating Plane
5.034.483.94.198.177
.155ATop to Seating Plane
2.54.100
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
c
eB
2
1
D
n
T
W
U
E1
p
A2
L
A1
A
B1
B
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MS-015
Drawing No. C04-084
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging