Datasheet

 1999-2013 Microchip Technology Inc. Preliminary DS41124D-page 147
PIC16C745/765
18.0 PACKAGING INFORMATION
18.1 Package Marking Information
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16C745-I/SO
YYWWNNN
28-Lead PDIP (Skinny DIP) Example
PIC16C745-I/SP
9917017
9917017
XXXXXXXXXX
YYWWNNN
28-Lead Side Braze Windowed (JW)
PIC16C745-I/JW
Example
9905017
XXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e