Datasheet
1999-2013 Microchip Technology Inc. Preliminary DS41124D-page 129
PIC16C745/765
16.1 DC Characteristics: PIC16C745/765 (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
D001 V
DD Supply Voltage 4.35 — 5.25 V See Figure 16-1
D002* V
DR RAM Data Retention
Voltage (Note 1)
—
1.5
—
V
D003 V
POR VDD Start Voltage to ensure
internal Power-on Reset signal
—
VSS
—
V See section on Power-on Reset for details
D004*
D004A*
S
VDD VDD Rise Rate to ensure
internal Power-on Reset signal
0.05
TBD
—
—
—
—
V/mS
V/mS
PWRT enabled (PWRTE bit clear)
PWRT disabled (PWRTE
bit set)
See section on Power-on Reset for details
D005 V
BOR Brown-out Reset
voltage trip point
3.65
—
4.35 V Brown-out Reset is always active
D010
D013
I
DD Supply Current
(Note 2, 4)
—
—
14
18
16
20
mA
mA
FINT = 24 MHz, VDD = 4.35V
F
INT = 24 MHz, VDD = 5.25V
D020
D021
D021B
I
PD Power-down Current
(Note 3, 4)
—
—
90
100
120
140
A
A
VDD = 4.35V w/ USB suspended
V
DD = 5.25V w/ USB suspended
D022*
D022A*
I
WDT
IUSB
PLL
Module Differential
Current (Note 5, 6)
Watchdog Timer
Not suspend mode
Phase Lock Loop
—
—
—
6.0
40
1.5
20
180
3.0
A
A
mA
WDTE bit set, V
DD = 4.35V
WDTE bit set, V
DD = 4.35V
WDTE bit set, V
DD = 4.35V
1A F
OSC HS oscillator operating freq.
H4 oscillator operating freg.
EC oscillator operating freq.
E4 oscillator operating freq.
24
6
24
6
—
—
—
—
24
6
24
6
MHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current
consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is
for design guidance only. This is not tested.
5: The current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD or IPD measurement.
6: Module differential currents measured at F
INT = 24 MHz.