Datasheet

PIC16C7X
DS30390E-page 260  1997 Microchip Technology Inc.
22.10 Package Marking Information
Legend:
MM...M
XX...X
AA
BB
C
D
1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
S = Tempe, Arizona, U.S.A.
AABBCAE
XXXXXXXXXXXX
XXXXXXXXXXXX
28-Lead SSOP
9517SBP
20I/SS025
PIC16C72
Example
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
AABBCDE
MMMMMMMMMMMMMMMM
Example
945/CAA
PIC16C73-10/SO
XXXXXXXXXXXXXXX
AABBCDE
28-Lead PDIP (Skinny DIP)
MMMMMMMMMMMM
AABBCDE
Example
PIC16C73-10/SP
Example28-Lead Side Brazed Skinny Windowed
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
PIC16C73/JW
9517CAT