Datasheet

PIC16C62B/72A
 1998-2013 Microchip Technology Inc. Preliminary DS35008C-page 107
15.3 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30 3.56 3.81
7.877.627.37.310.300.290W2Window Length
.150.140.130W1Window Width
10.809.788.76.425.385.345
eB
Overall Row Spacing
0.530.470.41.021.019.016BLower Lead Width
1.651.461.27.065.058.050B1Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.683.563.43.145.140.135LTip to Seating Plane
37.7237.0236.321.4851.4581.430DOverall Length
7.497.377.24.295.290.285E1Ceramic Pkg. Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.760.570.38.030.023.015A1Standoff
4.194.063.94.165.160.155A2Ceramic Package Height
4.954.644.32.195.183.170A
Top to Seating Plane
2.54.100
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
W2
W1
E1
E
eB
p
A2
L
B1
B
A1
A
*Controlling Parameter
c
JEDEC Equivalent: MO-058
Drawing No. C04-080