Datasheet

PIC16C62B/72A
DS35008C-page 106 Preliminary  1998-2013 Microchip Technology Inc.
15.2 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
1510515105

Mold Draft Angle Bottom
1510515105

Mold Draft Angle Top
10.928.898.13.430.350.320eBOverall Row Spacing
0.560.480.41.022.019.016BLower Lead Width
1.651.331.02.065.053.040B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
35.1834.6734.161.3851.3651.345DOverall Length
8.517.807.09.335.307.279E1Molded Package Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
3.433.303.18.135.130.125A2Molded Package Thickness
4.063.813.56.160.150.140ATop to Seating Plane
2.54
.100
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
E1
c
eB

E

p
L
A2
B
B1
A
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070