Datasheet
1999-2013 Microchip Technology Inc. DS41106C-page 75
PIC16C712/716
12.1 DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended)
PIC16C712/716-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0°C T
A +70°C for commercial
-40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
D001
D001A
V
DD Supply Voltage 4.0
4.5
V
BOR*
—
—
—
5.5
5.5
5.5
V
V
V
XT, RC and LP osc mode
HS osc mode
BOR enabled
(7)
D002* VDR
RAM Data Retention Voltage
(1)
—1.5—V
D003 V
POR VDD Start Voltage to ensure inter-
nal Power-on Reset signal
— VSS — V See section on Power-on Reset for details
D004*
D004A*
S
VDD VDD Rise Rate to ensure internal
Power-on Reset signal
0.05
TBD
—
—
—
—
V/ms PWRT enabled (PWRTE bit clear)
PWRT disabled (PWRTE
bit set)
See section on Power-on Reset for details
D005 V
BOR Brown-out Reset
voltage trip point
3.65 — 4.35 V BODEN bit set
D010
D013
I
DD
Supply Current
(2,5)
—
—
0.8
4.0
2.5
8.0
mA
mA
FOSC = 4 MHz, VDD = 4.0V
F
OSC = 20 MHz, VDD = 4.0V
D020
D021
D021B
I
PD
Power-down Current
(3,5)
—
—
—
—
10.5
1.5
1.5
2.5
42
16
19
19
A
A
A
A
VDD = 4.0V, WDT enabled,-40C to +85C
V
DD = 4.0V, WDT disabled, 0C to +70C
V
DD = 4.0V, WDT disabled,-40C to +85C
V
DD = 4.0V, WDT disabled,-40C to +125C
D022*
D022A*
I
WDT
IBOR
Module Differential Current
(6)
Watchdog Timer
Brown-out Reset
—
—
6.0
TBD
20
200
A
A
WDTE bit set, V
DD = 4.0V
BODEN bit set, V
DD = 5.0V
1A F
OSC LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
0
0
0
—
—
—
—
200
4
4
20
KHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the
part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD and VSS.
4: For RC Osc mode, current through R
EXT is not included. The current through the resistor can be estimated by the formula
Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for
design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base
I
DD or IPD measurement.
7: This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will operate correctly to
this trip point.