Datasheet

PIC16C71X
DS30272A-page 90  1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
11.1 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended)
PIC16C711-04 (Commercial, Industrial, Extended)
PIC16C710-10 (Commercial, Industrial, Extended)
PIC16C711-10 (Commercial, Industrial, Extended)
PIC16C710-20 (Commercial, Industrial, Extended)
PIC16C711-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ T
A ≤ +70˚C (commercial)
-40˚C ≤ T
A ≤ +85˚C (industrial)
-40˚C ≤ T
A ≤ +125˚C (extended)
Param.
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage V
DD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
V
DR - 1.5 - V
D003 V
DD start voltage to
ensure internal Power-
on Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* V
DD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage B
VDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
3.7 4.0 4.4 V Extended Range Only
D010
D013
Supply Current (Note 2) I
DD -
-
2.7
13.5
5
30
mA
mA
XT, RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
F
OSC = 20 MHz, VDD = 5.5V
D015 Brown-out Reset Current
(Note 5)
∆I
BOR - 300* 500 µA BOR enabled VDD = 5.0V
D020
D021
D021A
D021B
Power-down Current
(Note 3)
I
PD -
-
-
-
10.5
1.5
1.5
1.5
42
21
24
30
µA
µA
µA
µA
V
DD = 4.0V, WDT enabled, -40°C to +85°C
V
DD = 4.0V, WDT disabled, -0°C to +70°C
V
DD = 4.0V, WDT disabled, -40°C to +85°C
V
DD = 4.0V, WDT disabled, -40°C to +125°C
D023 Brown-out Reset Current
(Note 5)
∆I
BOR - 300* 500 µA BOR enabled VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.