Datasheet

PIC16C6X
DS30234E-page 300  1997-2013 Microchip Technology Inc.
24.14 Package Marking Information
Legend:
MM...M
XX...X
AA
BB
C
D
1
D
2
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Mask revision number for EEPROM
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
MMMMMMMMMMMMM
XXXXXXXXXXXXXXXX
AABBCDE
18-Lead PDIP
18-Lead SOIC
XXXXXXXXXXXX
AABBCDE
XXXXXXXXXXXX
MMMMMMMMMM
MMMMMM
XXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
PIC16C61-04/P
9450CBA
Example
Example
-20/SO
9449CBA
PIC16C61
PIC16C61
/JW
9440CBT
Example
S = Tempe, Arizona, U.S.A.
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCAE
28-Lead PDIP (.300 MIL)
PIC16C63-04I/SP
9452CAN
Example