Datasheet

PIC16C63A/65B/73B/74B
DS30605D-page 162  1998-2013 Microchip Technology Inc.
18.9 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead
Form (MQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
B
D1
E
CH
1510515105

Mold Draft Angle Bottom
1510515105

Mold Draft Angle Top
0.450.380.30.018.015.012Lead Width
0.230.180.13.009.007.005
c
Lead Thickness
1111n1Pins per Side
10.1010.009.90.398.394.390Molded Package Length
10.1010.009.90.398.394.390E1Molded Package Width
13.4513.2012.95.530.520.510DOverall Length
13.4513.2012.95.530.520.510Overall Width
73.5073.50

Foot Angle
1.030.880.73.041.035.029LFoot Length
0.250.150.05.010.006.002A1Standoff §
2.102.031.95.083.080.077A2Molded Package Thickness
2.35.093A
Overall Height
0.80.031
p
Pitch
4444
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
2
1
n
D1
D
B
p
E
E1
#leads=n1
c



A2
A
CH x 45

L
Pin 1 Corner Chamfer
Footprint (Reference)
(F)
.063 1.60
.025 .035 .045 0.64 0.89 1.14
(F)
A1
.079 .086 2.00 2.18
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging