Datasheet

 1998-2013 Microchip Technology Inc. DS30605D-page 161
PIC16C63A/65B/73B/74B
18.8 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form
(TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
1.140.890.64.045.035.025CHPin 1 Corner Chamfer
1.00.039
(F)
Footprint (Reference)
(F)
A
A1 A2

E
E1
#leads=n1
p
B
D1 D
n
1
2

c

L
Units INCHES MILLIMETERS*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
44 44
Pitch
p
.031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle

03.5 7 03.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length
D1
.390 .394 .398 9.90 10.00 10.10
Pins per Side
n1
11 11
Lead Thickness
c
.004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Mold Draft Angle Top

51015 51015
Mold Draft Angle Bottom

51015 51015
CH x 45

§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging