Datasheet

PIC16C63A/65B/73B/74B
DS30605D-page 160  1998-2013 Microchip Technology Inc.
18.7 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
9.148.898.64.360.350.340WWindow Diameter
18.0316.7615.49.710.660.610eBOverall Row Spacing §
0.580.510.41.023.020.016
B1
Lower Lead Width
1.401.331.27.055.053.050BUpper Lead Width
0.360.280.20.014.011.008
c
Lead Thickness
3.683.563.43.145.140.135LTip to Seating Plane
52.3252.0751.822.0602.0502.040DOverall Length
13.3613.2113.06.526.520.514
E1
Ceramic Pkg. Width
15.8815.2415.11.625.600.595EShoulder to Shoulder Width
1.521.140.76.060.045.030A1Standoff
4.194.063.94.165.160.155A2Ceramic Package Height
5.725.214.70.225.205.185ATop to Seating Plane
2.54.100
p
Pitch
40
40
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
c
eB
E
p
L
B1
B
A2
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-014
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging