Datasheet

 1997-2013 Microchip Technology Inc. DS30234E-page 301
PIC16C6X
Package Marking Information (Cont’d)
Legend:
MM...M
XX...X
AA
BB
C
D
1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
S = Tempe, Arizona, U.S.A.
AABBCAE
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCAE
XXXXXXXXXXXXXXXXXXXX
MMMMMMMMMMMMMMMMMMXX
28-Lead SOIC
28-Lead SSOP
9517SBP
20I/SS025
PIC16C62
9515SBA
PIC16C62-20/S0111
Example
Example
Example28-Lead Side Brazed Skinny Windowed
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
Example
PIC16C62/JW
9517SBT
28-Lead CERDIP Skinny Windowed
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AABBCDE
PIC16C66/JW
9517CAT
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
AABBCDE
40-Lead PDIP
MMMMMMMMMMMMMM
9510CAA
Example
PIC16C65-04/P