Datasheet

 1997-2013 Microchip Technology Inc. DS30234E-page 299
PIC16C6X
24.13 44-Lead Plastic Surface Mount (TQFP 10x10 mm Body 1.0/0.10 mm Lead Form) (TQ)
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
side. D1 and E1 dimensions including mold mismatch.
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
(0.003”)max.
3: This outline conforms to JEDEC MS-026.
Package Group: Plastic TQFP
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
A 1.00 1.20 0.039 0.047
A1 0.05 0.15 0.002 0.006
A2 0.95 1.05 0.037 0.041
D 11.75 12.25 0.463 0.482
D1 9.90 10.10 0.390 0.398
E 11.75 12.25 0.463 0.482
E1 9.90 10.10 0.390 0.398
L 0.45 0.75 0.018 0.030
e 0.80 BSC 0.031 BSC
b 0.30 0.45 0.012 0.018
b1 0.30 0.40 0.012 0.016
c 0.09 0.20 0.004 0.008
c1 0.09 0.16 0.004 0.006
N4444 4444
 0 7 0 7
D
E
D1
E1
Pin#1
2
e
1.0ø (0.039ø) Ref.
Option 1 (TOP side)
Pin#1
2
Option 2 (TOP side)
3.0ø (0.118ø) Ref.
Detail A
Detail B
L
1.00 Ref.
A2
A1
A
b
b1
c
c1
Base Metal
Detail A
Lead Finish
Detail B
11  /13  (4x)
0
 Min
11
 /13  (4x)

R1 0.08 Min
R 0.08/0.20
Gage Plane
0.250
L
L1
S
0.20
Min
1.00 Ref
Detail B
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging