Information

PIC16C63A/65B/73B/74B
DS80164A-page 6  2003 Microchip Technology Inc.
FIGURE 4: 28-PIN QFN PACKAGE (DRAWING 2, PACKAGING)
B
D2
D
PAD OUTLINE
ALTERNATE
SEE DETAIL
A1
A
DETAIL
TOP VIEW
OPTIONAL
INDEX
AREA
1
2
L
BOTTOM VIEW
n
E
METAL
PAD
ALTERNATE
EXPOSED
INDICATORS
INDEX
p
E2
Lead Width
*Controlling Parameter
Drawing No. C04-105
Notes:
JEDEC equivalent: mMO-220
B .009 .011 .013 0.23 0.28 0.33
Pitch
Number of Pins
Overall Width
Standoff
Overall Length
Overall Height
MAX
Units
Dimension Limits
A1
D
E
n
p
A
.000
INCHES
.026 BSC
MIN
28
NOM
MAX
.002 0.00
6.00
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.05
1.000.90.035
.001 0.02
Lead Length L .020 .022 .024 0.50 0.55 0.60
E2
D2
Exposed Pad Width
Exposed Pad Length
.140 .146 .152 3.55 3.70 3.85
.031 0.80
5.90 6.10.240.236.232
.232 .236 6.00.240 5.90 6.10
.140 .146 3.70.152 3.55 3.85
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Saw Singulated (QFN)