PIC16C63A/65B/73B/74B PIC16C63A/65B/73B/74B Data Sheet Errata The PIC16C63A/65B/73B/74B parts you have received conform functionally to the Device Data Sheet (DS30605C), except for the anomalies described below. None. 2003 Microchip Technology Inc.
PIC16C63A/65B/73B/74B Clarifications/Corrections to the Data Sheet: In the Device Data Sheet (DS30605C), the following clarifications and corrections should be noted. 1. Module: SSP (SPITM Mode) In Section 10.2 (“SPI Mode”), Figure 10-1 and the note box immediately beneath it have been amended to better demonstrate the Peripheral OE line of the SSP module and describe its relationship to the TRISC<5> bit of PORTC. Changes are indicated in bold.
PIC16C63A/65B/73B/74B 2. Module: Packaging (Pinout and Product Identification) PIC16C63A and PIC16C73B devices are now offered in 28-pin near chip-scale micro lead frame packages (commonly known as “QFN”). This packaging type has been added to the product line since the latest revision of the Device Data Sheet. The addition of this option requires the following additions to the Device Data Sheet. The referenced figures and tables follow this text. 1.
PIC16C63A/65B/73B/74B TABLE 3-1: PIC16C63A/73B PINOUT DESCRIPTION DIP Pin# Pin Name SOIC Pin# QFN Pin# I/O/P Type Buffer Type Description ST/CMOS(3) Oscillator crystal input/external clock source input. OSC1/CLKIN 9 9 6 I OSC2/CLKOUT 10 10 7 O — Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, the OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate.
PIC16C63A/65B/73B/74B FIGURE 3: 28-PIN QFN PACKAGE (DRAWING 1, PACKAGING) 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN) EXPOSED METAL PADS E E1 Q D1 D D2 p 2 1 B n R E2 CH X 45° TOP VIEW L BOTTOM VIEW α A2 A A1 A3 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Base Thickness Overall Width Molded Package Width Exposed Pad Width Overall Length Molded Package Length Exposed Pad Length Lead Width Lead Leng
PIC16C63A/65B/73B/74B FIGURE 4: 28-PIN QFN PACKAGE (DRAWING 2, PACKAGING) 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Saw Singulated (QFN) E E2 EXPOSED METAL PAD p D D2 2 B 1 n TOP VIEW ALTERNATE INDEX INDICATORS OPTIONAL INDEX AREA SEE DETAIL L BOTTOM VIEW A1 A DETAIL ALTERNATE PAD OUTLINE Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Overall Length Exposed Pad Length Lead Width Lead Length Units Dimension Limits n p A A1 E E2 D D2 B L MIN
PIC16C63A/65B/73B/74B 3. Module: RESET Section 13.4.1 (“POWER-ON RESET (POR)”) has been amended to clarify the minimum specifications required for MCLR in order to RESET the PIC16CXXX. The following paragraphs and figure have been added: If a MCLR pulse occurs that is less that the minimum specification (parameter #30), improper device operation can occur.
PIC16C63A/65B/73B/74B REVISION HISTORY Rev A Document (7/2003) First revision of this document. Device Data Sheet Clarification issues 1 (SSP), 2 (Packaging) and 3 (RESET). DS80164A-page 8 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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