Information
2003 Microchip Technology Inc. DS80048C-page 3
PIC16C63A/65B/73B/74B
2. Module: Packaging (Pinout and Product
Identification)
PIC16C63A and PIC16C73B devices are now
offered in 28-pin near chip scale micro lead frame
packages (commonly known as “QFN”). This
packaging type has been added to the product line
since the latest revision of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS30605C).
The referenced figures and tables follow this text.
1. The “Pin Diagram” on page 2 of the Data Sheet
is amended with the addition of the 28-pin QFN
pinout, shown in Figure 2.
2. Table 3-1 of Section 3.0 (“Architectural
Overview”) is replaced with an updated version
that adds a column for QFN pin assignments.
All new information is indicated in bold.
3. Section 18.1 (“Package Marking Information”)
is amended to include a marking template and
example for 28-pin QFN devices. These are
shown in Figure 3.
4. Section 18.0 (“Packaging Information”) is
amended to include the mechanical drawings
of the 28-pin QFN package. These are shown
in Figure 4 and Figure 5, respectively.
5. Table B-1 (“Device Differences”) is amended to
include the 28-pin QFN for the PIC16C63A and
PIC16C73B devices.
FIGURE 2: PINOUT DIAGRAM FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
FIGURE 3: PACKAGE MARKING TEMPLATE FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
2
3
4
5
6
1
7
MCLR/VPP
RA0/AN0
RA1/AN1
RA2/AN2
RA3/AN3/V
REF+
RA4/T0CKI
RA5/AN4/SS
15
16
17
18
19
20
21
RB0/INT
V
DD
VSS
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
VSS
OSC2/CLKO
OSC1/CLKI
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/CCP1
RC3/SCK/SCL
23
24
25
26
27
28
22
RB7
RB6
RB5
RB4
RB3
RB2
RB1
10
11
8
9
12
13 14
QFN (28-pin)
PIC16C63A
PIC16C73B
28-Lead QFN Example
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PIC16C63A
-I/ML
0310017