Datasheet

PIC16C62X
DS30235J-page 94  2003 Microchip Technology Inc.
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all I
DD measurements in Active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be estimated by the
formula: Ir = V
DD/2REXT (mA) with REXT in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD or IPD measurement.
6: Commercial temperature range only.
PIC16CR62XA-04
PIC16CR62XA-20
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial and
-40°C ≤ T
A ≤ +125°C for extended
PIC16LCR62XA-04
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial and
-40°C ≤ T
A ≤ +125°C for extended
Param.
No.
Sym Characteristic Min Typ† Max Units Conditions