Datasheet
PIC16C62X
DS30235J-page 88 2003 Microchip Technology Inc.
12.1 DC Characteristics: PIC16C62X-04 (Commercial, Industrial, Extended)
PIC16C62X-20 (Commercial, Industrial, Extended)
PIC16LC62X-04 (Commercial, Industrial, Extended)
PIC16C62X
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial and
-40°C ≤ T
A ≤ +125°C for extended
PIC16LC62X
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial and
-40°C ≤ T
A ≤ +125°C for extended
Operating voltage V
DD range is the PIC16C62X range.
Param.
No.
Sym Characteristic Min Typ† Max Units Conditions
D001 VDD Supply Voltage 3.0
—
6.0 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5
D001 VDD Supply Voltage 2.5 — 6.0 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5
D002 V
DR
RAM Data Retention Voltage
(1)
—
1.5*
—
V Device in SLEEP mode
D002 VDR RAM Data Retention Voltage
(1)
— 1.5* — V Device in SLEEP mode
D003 V
POR VDD start voltage to ensure
Power-on Reset
—
Vss
—
V See section on Power-on Reset for details
D003 VPOR VDD start voltage to
ensure Power-on Reset
— VSS — V See section on Power-on Reset for details
D004 S
VDD VDD rise rate to ensure
Power-on Reset
0.05*
——
V/ms See section on Power-on Reset for details
D004 SVDD VDD rise rate to ensure
Power-on Reset
0.05* — — V/ms See section on Power-on Reset for details
D005 V
BOR Brown-out Detect Voltage 3.7 4.0 4.3 V BOREN configuration bit is cleared
D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.3 V BOREN configuration bit is cleared
D010 I
DD
Supply Current
(2)
—
—
—
1.8
35
9.0
3.3
70
20
mA
µA
mA
F
OSC = 4 MHz, VDD = 5.5V, WDT disabled, XT
mode, (Note 4)*
F
OSC = 32 kHz, VDD = 4.0V, WDT disabled, LP
mode
F
OSC = 20 MHz, VDD = 5.5V, WDT disabled, HS
mode
D010 IDD
Supply Current
(2)
—
—
1.4
26
2.5
53
mA
µA
FOSC = 2.0 MHz, VDD = 3.0V, WDT disabled, XT
mode, (Note 4)
F
OSC = 32 kHz, VDD = 3.0V, WDT disabled, LP
mode
D020 I
PD
Power-down Current
(3)
—
1.0 2.5
15
µA
µA
VDD=4.0V, WDT disabled
(125°C)
D020 IPD Power-down Current
(3)
— 0.7 2 µA VDD=3.0V, WDT disabled
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all I
DD measurements in Active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be estimated by the
formula: Ir = V
DD/2REXT (mA) with REXT in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD or IPD measurement.