Datasheet
2003 Microchip Technology Inc. DS30235J-page 99
PIC16C62X
12.5 DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40
(7)
(Commercial)
PIC16CR620A-40
(7)
(Commercial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0°C ≤ TA ≤ +70°C for commercial
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
D001 VDD Supply Voltage 3.0 — 5.5 V FOSC = DC to 20 MHz
D002 VDR RAM Data Retention Voltage
(1)
— 1.5* — V Device in SLEEP mode
D003 VPOR VDD start voltage to ensure
Power-on Reset
— VSS — V See section on Power-on Reset for details
D004 SVDD VDD rise rate to ensure Power-on
Reset
0.05
*
— — V/ms See section on Power-on Reset for details
D005 VBOR Brown-out Detect Voltage 3.65 4.0 4.35 V BOREN configuration bit is cleared
D010 IDD Supply Current
(2,4)
—
—
—
—
—
—
1.2
0.4
1.0
4.0
4.0
35
2.0
1.2
2.0
6.0
7.0
70
mA
mA
mA
mA
mA
µA
FOSC = 4 MHz, VDD = 5.5V, WDT disabled,
XT O
SC mode, (Note 4)*
FOSC = 4 MHz, VDD = 3.0V, WDT disabled,
XT O
SC mode, (Note 4)
FOSC = 10 MHz, VDD = 3.0V, WDT disabled,
HS O
SC mode, (Note 6)
FOSC = 20 MHz, VDD = 4.5V, WDT disabled,
HS OSC mode
FOSC = 20 MHz, VDD = 5.5V, WDT disabled*,
HS O
SC mode
FOSC = 32 kHz, VDD = 3.0V, WDT disabled,
LP O
SC mode
D020 IPD Power Down Current
(3)
—
—
—
—
—
—
—
—
2.2
5.0
9.0
15
µA
µA
µA
µA
VDD = 3.0V
VDD = 4.5V*
VDD = 5.5V
VDD = 5.5V Extended
D022
D022A
D023
D023A
∆IWDT
∆IBOR
∆ICOMP
∆IVREF
WDT Current
(5)
Brown-out Reset Current
(5)
Comparator Current for each
Comparator
(5)
VREF Current
(5)
—
—
—
—
6.0
75
30
80
10
12
125
60
135
µA
µA
µA
µA
µA
VDD = 4.0V
(125°C)
BOD enabled, VDD = 5.0V
VDD = 4.0V
VDD = 4.0V
∆IEE Write
∆IEE Read
∆IEE
∆IEE
Operating Current
Operating Current
Standby Current
Standby Current
—
—
—
—
3
1
30
100
mA
mA
µA
µA
VCC = 5.5V, SCL = 400 kHz
VCC = 3.0V, EE VDD = VCC
VCC = 3.0V, EE VDD = VCC
1A FOSC LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
0
0
0
—
—
—
—
200
4
4
20
kHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate,
oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.
The test conditions for all I
DD measurements in Active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD, MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP
mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
4: For RC
OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/
2R
EXT (mA) with REXT in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base I
DD or IPD
measurement.
6: Commercial temperature range only.
7: See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified
characteristics.