Information
2004 Microchip Technology Inc. DS80101D-page 13
PIC16C62X
D022
D022A
D023
D023A
∆IWDT
∆IBOR
∆ICOMP
∆IVREF
WDT Current (Note 5)
Brown-out Reset Current (Note 5)
Comparator Current for each
Comparator (Note 5)
V
REF Current (Note 5)
–
–
–
–
6.0
75
30
80
10
12
125
60
135
µA
µA
µA
µA
µA
V
DD = 4.0V
(125°C)
BOD
enabled, VDD = 5.0V
V
DD = 4.0V
V
DD = 4.0V
∆I
EE Write
∆I
EE Read
∆I
EE
∆IEE
Operating Current
Operating Current
Standby Current
Standby Current
–
–
–
–
3
1
30
100
mA
mA
µA
µA
VCC = 5.5V, SCL = 400 kHz
V
CC = 3.0V, EE VDD = VCC
VCC = 3.0V, EE VDD = VCC
1A FOSC LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
0
0
0
–
–
–
–
200
4
4
20
kHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
TABLE 1: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40
(7)
(Commercial)
PIC16CR620A-40
(7)
(Commercial)
PIC16CE62X-30
(8)
(Commercial) (CONTINUED)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature –40°C ≤ T
A ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial and
–40°C ≤ T
A ≤ +125°C for extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD, MCLR = VDD; WDT enabled/disabled
as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
4: For RC
OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the
formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD or IPD measurement.
6: Commercial temperature range only.
7: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified
characteristics.
8: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics.