Datasheet

 1997-2013 Microchip Technology Inc. Preliminary DS30453E-page 179
PIC16C5X
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
10501050Mold Draft Angle Bottom
10501050

Mold Draft Angle Top
0.380.320.25.015.013.010BLead Width
203.20101.600.00840

Foot Angle
0.250.180.10.010.007.004
c
Lead Thickness
0.940.750.56.037.030.022LFoot Length
10.3410.2010.06.407.402.396DOverall Length
5.385.255.11.212.207.201E1Molded Package Width
8.107.857.59.319.309.299EOverall Width
0.250.150.05.010.006.002A1Standoff §
1.831.731.63.072.068.064A2Molded Package Thickness
1.981.851.73.078.073.068AOverall Height
0.65.026
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
2
1
D
p
n
B
E1
E
L

c


A2
A1
A

§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging