Datasheet

 1997-2013 Microchip Technology Inc. Preliminary DS30453E-page 173
PIC16C5X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105

Mold Draft Angle Bottom
1510515105

Mold Draft Angle Top
10.929.407.87.430.370.310
eB
Overall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.461.14.070.058.045B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
22.9922.8022.61.905.898.890DOverall Length
6.606.356.10.260.250.240E1Molded Package Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
3.683.302.92.145.130.115
A2
Molded Package Thickness
4.323.943.56.170.155.140ATop to Seating Plane
2.54
.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
E1
c
eB

E

p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging