Datasheet

 1997-2013 Microchip Technology Inc. Preliminary DS30453E-page 181
PIC16C5X
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
7.377.116.86.290.280.270WWindow Diameter
18.0316.7615.49.710.660.610eBOverall Row Spacing §
0.580.510.41.023.020.016BLower Lead Width
1.651.461.27.065.058.050B1Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.813.493.18.150.138.125LTip to Seating Plane
37.8537.0836.321.4901.4601.430DOverall Length
13.3613.2113.06.526.520.514E1Ceramic Pkg. Width
15.8815.2415.11.625.600.595EShoulder to Shoulder Width
1.520.950.38.060.038.015A1Standoff
4.194.063.94.165.160.155A2Ceramic Package Height
5.725.334.95.225.210.195ATop to Seating Plane
2.54.100
p
Pitch
28
28
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
E1
W
c
E
eB
p
A2
L
B1
B
A1
A
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging