Datasheet

PIC16C5X
DS30453E-page 176 Preliminary  1997-2013 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
Foot Angle

048048
1512015120

Mold Draft Angle Bottom
1512015120

Mold Draft Angle Top
0.510.420.36.020.017.014BLead Width
0.300.270.23.012.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length
0.740.500.25.029.020.010hChamfer Distance
11.7311.5311.33.462.454.446DOverall Length
7.597.497.39.299.295.291E1Molded Package Width
10.6710.3410.01.420.407.394EOverall Width
0.300.200.10.012.008.004A1Standoff §
2.392.312.24.094.091.088A2Molded Package Thickness
2.642.502.36.104.099.093AOverall Height
1.27.050
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
L

c

h
45
1
2
D
p
n
B
E1
E

A2
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging