Datasheet

PIC16C5X
DS30453E-page 180 Preliminary  1997-2013 Microchip Technology Inc.
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30 3.56 3.81
5.335.084.83.210.200.190W2Window Length
.150.140.130W1Window Width
10.809.788.76.425.385.345
eB
Overall Row Spacing §
0.530.470.41.021.019.016BLower Lead Width
1.521.401.27.060.055.050
B1
Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.813.493.18.150.138.125LTip to Seating Plane
23.3722.8622.35.920.900.880DOverall Length
7.497.377.24.295.290.285E1Ceramic Pkg. Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.760.570.38.030.023.015A1Standoff
4.194.063.94.165.160.155A2Ceramic Package Height
4.954.644.32.195.183.170A
Top to Seating Plane
2.54.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
W2
E1
W1
c
eB
E
p
L
A2
B
B1
A
A1
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging