Datasheet
PIC16C55X
DS40143E-page 76 Preliminary 1996-2013 Microchip Technology Inc.
10.1 DC Characteristics: PIC16C55X-04 (Commercial, Industrial, Extended)
PIC16C55X-20 (Commercial, Industrial, Extended)
HCS1365-04 (Commercial, Industrial, Extended)
DC Characteristics
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C T
A +85C for industrial and
0C T
A +70C for commercial and
-40C T
A +125C for extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
V
DD Supply Voltage
D001 16LC55X 3.0
2.5
—5.5
5.5
V XT and RC osc configuration
LP osc configuration
D001
D001A
16C55X 3.0
4.5
—
—
5.5
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002 V
DR RAM Data Retention
Voltage
(1)
— 1.5* — V Device in SLEEP mode
D003 V
POR VDD Start Voltage to
ensure Power-on Reset
—VSS — V See Section 6.4, Power-on Reset for
details
D004 S
VDD VDD Rise Rate to ensure
Power-on Reset
0.05* — — V/ms See Section 6.4, Power-on Reset for
details
IDD Supply Current
(2)
D010
D010A
16LC55X
—
—
1.4
26
2.5
53
mA
A
XT and RC osc configuration
Fosc = 2.0 MHz, V
DD = 3.0V, WDT
disabled
(4)
LP osc configuration
Fosc = 32 kHz, V
DD = 3.0V, WDT
disabled
D010
D010A
D013
16C55X
—
—
—
1.8
35
9.0
3.3
70
20
mA
A
mA
XT and RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V,
WDT disabled
(4)
LP osc configuration,
PIC16C55X-04 only
FOSC = 32 kHz, VDD = 4.0V,
WDT disabled
HS osc configuration
F
OSC = 20 MHz, VDD = 5.5V,
WDT disabled
* These parameters are characterized but not tested.
† Data is “Typ” column is at 5V, 25C,unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins configured as input, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins configured as input and tied to V
DD or VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2REXT (mA) with REXT in k
5: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.