Information

PIC16C505
DS80060D-page 10 © 2007 Microchip Technology Inc.
5. Module: Packaging (TSSOP)
Update data sheet to include TSSOP as follows:
Pin Diagram:
PIC16C505 Product Identification System
10.3 Package Marking Information
PDIP, SOIC, TSSOP, Ceramic Side Brazed
PIC16C505
VDD
RB5/OSC1/CLKIN
RB4/OSC2/CLKOUT
RB3/MCLR
/VPP
RC5/T0CKI
RC4
RC3
V
SS
RB0
RB1
RB2
RC0
RC1
RC2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Pattern: Special Requirements
Package: SL = 150 mil SOIC
P = 300 mil PDIP
JW = 300 mil Windowed Ceramic Side Brazed
ST = Thin Shrink Small Outline (TSSOP)
Temperature
Range:
-=0°C to +70°C
I=-40°C to +85°C
E=-40°C to +125°C
Frequency
Range:
04 = 4 MHz (XT, INTRC, EXTRC OSC)
20 = 20 MHz (HS OSC)
Device PIC16C505
PIC16LC505
PIC16C505T (Tape & reel for SOIC only)
PIC16LC505T (Tape & reel for SOIC only)
PART NO. -XX X /XX XXX
Examples
a) PIC16C505-04/P
Commercial Temp.,
PDIP Package, 4 MHz,
normal V
DD limits
b) PIC16C505-04I/SL
Industrial Temp., SOIC
package, 4 MHz, normal
V
DD limits
c) PIC16C505-04I/P
Industrial Temp.,
PDIP package, 4 MHz,
normal V
DD limits
14-Lead TSSOP
XXXXXXXX
YYWW
NNN
Example
C505/ST
0610
017