Datasheet

PIC16C505
DS40192D-page 58  1999-2012 Microchip Technology Inc.
10.1 DC CHARACTERISTICS: PIC16C505-04 (Commercial, Industrial, Extended)
PIC16C505-20(Commercial, Industrial, Extended)
DC Characteristics
Power Supply Pins
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0C  T
A  +70C (commercial)
–40C  T
A  +85C (industrial)
–40C  T
A  +125C (extended)
Parm.
No.
Characteristic Sym Min Typ
(1)
Max Units Conditions
D001 Supply Voltage VDD 3.0 5.5 V See Figure 10-1 through Figure 10-3
D002 RAM Data Retention
Voltage
(2)
VDR — 1.5* — V Device in SLEEP mode
D003 V
DD Start Voltage to ensure
Power-on Reset
VPOR —VSS — V See section on Power-on Reset for details
D004 V
DD Rise Rate to ensure
Power-on Reset
SVDD 0.05* — — V/ms See section on Power-on Reset for details
D010 Supply Current
(3)
IDD —
—
—
—
—
—
0.8
0.6
3
4
4.5
19
1.4
1.0
7
12
16
27
mA
mA
mA
mA
mA
A
FOSC = 4MHz, VDD = 5.5V, WDT disabled (Note 4)*
F
OSC = 4MHz, VDD = 3.0V, WDT disabled (Note 4)
F
OSC = 10MHz, VDD = 3.0V, WDT disabled (Note 6)
F
OSC = 20MHz, VDD = 4.5V, WDT disabled
F
OSC = 20MHz, VDD = 5.5V, WDT disabled*
F
OSC = 32kHz, VDD = 3.0V, WDT disabled (Note 6)
D020 Power-Down Current
(5)
IPD —
—
—
—
0.25
0.4
3
5
4
5.5
8
14
A
A
A
A
VDD = 3.0V (Note 6)
V
DD = 4.5V* (Note 6)
V
DD = 5.5V, Industrial
V
DD = 5.5V, Extended Temp.
D022 WDT Current
(5)
IWDT —2.2 5 AVDD = 3.0V (Note 6)
1A LP Oscillator Operating
Frequency
RC Oscillator Operating
Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
Fosc
0
0
0
0
—
—
—
—
200
4
4
20
kHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
2: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus
rate, internal code execution pattern and temperature also have an impact on the current consumption.
a) The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to V
SS, T0CKI = VDD, MCLR = VDD;
WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the formula:
I
R = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in
SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
6: Commercial temperature range only.