Datasheet

PIC12F683
DS41211D-page 162 © 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Package may have one or more exposed tie bars at ends.
3
. Package is saw singulated.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.80 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 4.00 BSC
Exposed Pad Width E2 0.00 2.20 2.80
Overall Width E 4.00 BSC
Exposed Pad Length D2 0.00 3.00 3.60
Contact Width b 0.25 0.30 0.35
Contact Length L 0.30 0.55 0.65
Contact-to-Exposed Pad K 0.20 – –
D
N
E
NOTE 1
1
2
A3
A
A1
NOTE 2
NOTE 1
D2
1
2
E2
L
N
e
b
K
EXPOSED
PAD
TOP VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-131
C