Datasheet

PIC12F683

15.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ T

A ≤ +125°C

Param

No.

Sym Characteristic Typ Units Conditions

TH01 θ

JA Thermal Resistance

Junction to Ambient

84.6 °C/W 8-pin PDIP package

163.0 °C/W 8-pin SOIC package

52.4 °C/W 8-pin DFN-S 4x4x0.9 mm package

46.3 °C/W 8-pin DFN-S 6x5 mm package

TH02 θ

JC Thermal Resistance

Junction to Case

41.2 °C/W 8-pin PDIP package

38.8 °C/W 8-pin SOIC package

3.0 °C/W 8-pin DFN-S 4x4x0.9 mm package

2.6 °C/W 8-pin DFN-S 6x5 mm package

TH03 T

J Junction Temperature 150 °C For derated power calculations

TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O

TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD

(NOTE 1)

TH06 P

I/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

TH07 PDER Derated Power — W PDER = (TJ - TA)/θJA

(NOTE 2, 3)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature.

3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power (P

DER).