Datasheet

PIC12F609/615/617/12HV609/615
DS41302D-page 154  2010 Microchip Technology Inc.
16.9 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym Characteristic Typ Units Conditions
TH01 
JA Thermal Resistance
Junction to Ambient
84.6* C/W 8-pin PDIP package
149.5* C/W 8-pin SOIC package
211* C/W 8-pin MSOP package
60* C/W 8-pin DFN 3x3mm package
44* C/W 8-pin DFN 4x4mm package
TH02 
JC Thermal Resistance
Junction to Case
41.2* C/W 8-pin PDIP package
39.9* C/W 8-pin SOIC package
39* C/W 8-pin MSOP package
9* C/W 8-pin DFN 3x3mm package
3.0* C/W 8-pin DFN 4x4mm package
TH03 T
DIE Die Temperature 150* C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD -
V
OH))
TH07 PDER Derated Power — W PDER = PDMAX (TDIE - TA)/JA
(NOTE 2)
* These parameters are characterized but not tested.
Note 1: I
DD is current to run the chip alone without driving any load on the output pins.
2: T
A
= Ambient temperature.