Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller MSOP 8 8-Bit 8 MHz I/O number 5

Table Of Contents

High-Performance RISC CPU:
Special Microcontroller Features:
Low-Power Features/CMOS Technology:
Peripheral Features:
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 General Description
- 1.1 Applications
  - TABLE 1-1: Features and memory of PIC12F519
2.0 PIC12F519 Device Varieties
- 2.1 Quick Turn Programming (QTP) Devices
- 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices
3.0 Architectural Overview
- TABLE 3-1: PIC12F519 Memory
- FIGURE 3-1: PIC12F519 ARCHITECTURAL Block Diagram
- TABLE 3-2: PIC12F519 Pinout Description
- 3.1 Clocking Scheme/Instruction Cycle
- 3.2 Instruction Flow/Pipelining
  - FIGURE 3-2: Clock/Instruction Cycle
  - EXAMPLE 3-1: Instruction Pipeline Flow
4.0 Memory Organization
- 4.1 Program Memory Organization for the PIC12F519
  - FIGURE 4-1: Memory Map
- 4.2 Data Memory (SRAM and FSRs)
  - 4.2.1 General Purpose Register File
    - FIGURE 4-2: Register File Map
  - 4.2.2 Special Function Registers
    - TABLE 4-1: Special Function Register Summary
- 4.3 STATUS register
  - Register 4-1: STATUS: STATUS Register
- 4.4 OPTION Register
  - Register 4-2: OPTION: OPTION Register
- 4.5 OSCCAL Register
  - Register 4-3: OSCCAL: Oscillator Calibration Register
- 4.6 Program Counter
  - FIGURE 4-3: Loading of PC Branch Instructions
  - 4.6.1 Effects Of Reset
- 4.7 Stack
- 4.8 Indirect Data Addressing: INDF and FSR Registers
  - EXAMPLE 4-1: How to Clear RAM Using Indirect Addressing
  - FIGURE 4-4: Direct/Indirect Addressing
5.0 Flash Data Memory Control
- 5.1 Reading Flash Data Memory
- 5.2 Writing and Erasing Flash Data Memory
  - 5.2.1 Erasing Flash Data Memory
  - 5.2.2 Writing to Flash Data Memory
- 5.3 Write Verify
- 5.4 Code Protection
6.0 I/O Port
- 6.1 GPIO
- 6.2 TRIS Registers
- 6.3 I/O Interfacing
- 6.4 I/O Programming Considerations
  - 6.4.1 Bidirectional I/O Ports
    - EXAMPLE 6-1: Read-modify-write Instructions on an I/O Port
  - 6.4.2 Successive Operations on I/O Ports
    - FIGURE 6-6: Successive I/O OperatioN
7.0 Timer0 Module and TMR0 Register
- FIGURE 7-1: Timer0 Block Diagram
- FIGURE 7-2: TIMER0 Timing: Internal Clock/No Prescale
- FIGURE 7-3: TIMER0 Timing: Internal Clock/Prescale 1:2
- TABLE 7-1: Registers Associated With TIMER0
- 7.1 Using Timer0 with an External Clock
  - 7.1.1 External Clock Synchronization
  - 7.1.2 TIMER0 Increment Delay
    - FIGURE 7-4: TIMER0 Timing with External Clock
- 7.2 Prescaler
  - 7.2.1 Switching Prescaler Assignment
8.0 Special Features Of The CPU
- 8.1 Configuration Bits
  - Register 8-1: CONFIG: Configuration Word Register(1)
- 8.2 Oscillator Configurations
- 8.3 Reset
- 8.4 Power-on Reset (POR)
- 8.5 Device Reset Timer (DRT)
  - TABLE 8-5: DRT (Device Reset Timer Period)
- 8.6 Watchdog Timer (WDT)
  - 8.6.1 WDT Period
  - 8.6.2 WDT Programming Considerations
    - FIGURE 8-11: Watchdog Timer Block Diagram
    - TABLE 8-6: Summary of Register Associated with the Watchdog Timer
- 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO, PD, GPWUF)
  - TABLE 8-7: TO/PD/(GPWUF) Status After Reset
- 8.8 Power-down Mode (Sleep)
  - 8.8.1 Sleep
  - 8.8.2 Wake-up from Sleep
- 8.9 Program Verification/Code Protection
- 8.10 ID Locations
- 8.11 In-Circuit Serial Programming™
  - FIGURE 8-12: Typical In-Circuit Serial Programming Connection
9.0 Instruction Set Summary
- TABLE 9-1: Opcode Field Descriptions
- FIGURE 9-1: General Format for Instructions
- TABLE 9-2: Instruction Set Summary
10.0 Development Support
- 10.1 MPLAB Integrated Development Environment Software
- 10.2 MPASM Assembler
- 10.3 MPLAB C18 and MPLAB C30 C Compilers
- 10.4 MPLINK Object Linker/ MPLIB Object Librarian
- 10.5 MPLAB ASM30 Assembler, Linker and Librarian
- 10.6 MPLAB SIM Software Simulator
- 10.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 10.8 MPLAB REAL ICE In-Circuit Emulator System
- 10.9 MPLAB ICD 2 In-Circuit Debugger
- 10.10 MPLAB PM3 Device Programmer
- 10.11 PICSTART Plus Development Programmer
- 10.12 PICkit 2 Development Programmer
- 10.13 Demonstration, Development and Evaluation Boards
11.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
  - FIGURE 11-1: PIC12F519 Voltage-Frequency Graph, -40°C £ ta £ +125°C
  - FIGURE 11-2: Maximum Oscillator Frequency Table
- 11.1 DC Characteristics
- 11.2 Timing Parameter Symbology and Load Conditions – PIC12F519
  - FIGURE 11-3: Load Conditions – PIC12F519
  - FIGURE 11-4: External Clock Timing – PIC12F519
- 11.3 AC Characteristics
12.0 DC and AC Characteristics Graphs and Charts
- FIGURE 12-1: Typical Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-2: Maximum Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-3: Idd vs. Vdd over fosc (LP Mode)
- FIGURE 12-4: Typical Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-5: Maximum Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-6: Typical WDT Ipd VS. Vdd
- FIGURE 12-7: Maximum WDT Ipd VS. Vdd Over Temperature
- FIGURE 12-8: WDT TIME-OUT VS. Vdd Over Temperature (No Prescaler)
- FIGURE 12-9: Vol VS. Iol Over Temperature (Vdd = 3.0V)
- FIGURE 12-10: Vol VS. Iol Over Temperature (Vdd = 5.0V)
- FIGURE 12-11: Voh VS. Ioh Over Temperature (Vdd = 3.0V)
- FIGURE 12-12: Voh VS. Ioh Over Temperature (Vdd = 5.0V)
- FIGURE 12-13: TTL Input Threshold Vin VS. Vdd
- FIGURE 12-14: Schmitt Trigger Input Threshold Vin VS. Vdd
- FIGURE 12-15: Device Reset Timer (XT and LP) vs. Vdd
13.0 Packaging Information
- 13.1 Package Marking Information
Appendix A: Revision History
INDEX
The Microchip Web Site
Customer Change Notification Service
Customer Support
Reader Response
Product Identification System
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PIC12F519

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX XXX

PatternPackageTemperature

Range

Device

Device: PIC12F519

PIC12F519T (Tape and Reel)

Temperature

Range:

I= -40°C to +85°C (Industrial)

E= -40°C to +125°C (Extended)

Package: MC = 8L DFN 2x3 (DUAL Flatpack No-Leads)

MS = MSOP (Pb-free)

P = 300 mil PDIP (Pb-free)

SN = 3.90 mm SOIC, 8-LD (Pb-free)

Pattern: Special Requirements

Examples:

a) PIC12F519-I/P = Industrial temp., PDIP

package (Pb-free)

b) PIC12F519T-I/SN = Tape and Reel, Industrial

temp., SOIC package

c) PIC12F519 - E/MS 303 = Extended temp.,

MSOP package, QTP pattern #303

Note: Tape and Reel available for only the following packages: SOIC, DFN and

MSOP.