Datasheet

Table Of Contents
© 2008 Microchip Technology Inc. DS41319B-page 81
PIC12F519
13.0 PACKAGING INFORMATION
13.1 Package Marking Information
XXXXXNNN
8-Lead PDIP
XXXXXXXX
YYWW
/P017
Example
12F519-I
0610
8-Lead SOIC (3.90 mm)
XXXXXXXX
XXXXYYWW
NNN
Example
12F519-I
/SN0610
017
8-Lead MSOP
XXXXXX
YWWNNN
Example
519/MS
610017
X X X
Y W W
N N
8-Lead 2x3 DFN*
B Y 0
6 1 0
1 7
Example
* Standard PIC
®
device marking consists of Microchip part number, year code, week code, and traceability
code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e