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ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller MSOP 8 8-Bit 8 MHz I/O number 5

Table Of Contents

High-Performance RISC CPU:
Special Microcontroller Features:
Low-Power Features/CMOS Technology:
Peripheral Features:
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 General Description
- 1.1 Applications
  - TABLE 1-1: Features and memory of PIC12F519
2.0 PIC12F519 Device Varieties
- 2.1 Quick Turn Programming (QTP) Devices
- 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices
3.0 Architectural Overview
- TABLE 3-1: PIC12F519 Memory
- FIGURE 3-1: PIC12F519 ARCHITECTURAL Block Diagram
- TABLE 3-2: PIC12F519 Pinout Description
- 3.1 Clocking Scheme/Instruction Cycle
- 3.2 Instruction Flow/Pipelining
  - FIGURE 3-2: Clock/Instruction Cycle
  - EXAMPLE 3-1: Instruction Pipeline Flow
4.0 Memory Organization
- 4.1 Program Memory Organization for the PIC12F519
  - FIGURE 4-1: Memory Map
- 4.2 Data Memory (SRAM and FSRs)
  - 4.2.1 General Purpose Register File
    - FIGURE 4-2: Register File Map
  - 4.2.2 Special Function Registers
    - TABLE 4-1: Special Function Register Summary
- 4.3 STATUS register
  - Register 4-1: STATUS: STATUS Register
- 4.4 OPTION Register
  - Register 4-2: OPTION: OPTION Register
- 4.5 OSCCAL Register
  - Register 4-3: OSCCAL: Oscillator Calibration Register
- 4.6 Program Counter
  - FIGURE 4-3: Loading of PC Branch Instructions
  - 4.6.1 Effects Of Reset
- 4.7 Stack
- 4.8 Indirect Data Addressing: INDF and FSR Registers
  - EXAMPLE 4-1: How to Clear RAM Using Indirect Addressing
  - FIGURE 4-4: Direct/Indirect Addressing
5.0 Flash Data Memory Control
- 5.1 Reading Flash Data Memory
- 5.2 Writing and Erasing Flash Data Memory
  - 5.2.1 Erasing Flash Data Memory
  - 5.2.2 Writing to Flash Data Memory
- 5.3 Write Verify
- 5.4 Code Protection
6.0 I/O Port
- 6.1 GPIO
- 6.2 TRIS Registers
- 6.3 I/O Interfacing
- 6.4 I/O Programming Considerations
  - 6.4.1 Bidirectional I/O Ports
    - EXAMPLE 6-1: Read-modify-write Instructions on an I/O Port
  - 6.4.2 Successive Operations on I/O Ports
    - FIGURE 6-6: Successive I/O OperatioN
7.0 Timer0 Module and TMR0 Register
- FIGURE 7-1: Timer0 Block Diagram
- FIGURE 7-2: TIMER0 Timing: Internal Clock/No Prescale
- FIGURE 7-3: TIMER0 Timing: Internal Clock/Prescale 1:2
- TABLE 7-1: Registers Associated With TIMER0
- 7.1 Using Timer0 with an External Clock
  - 7.1.1 External Clock Synchronization
  - 7.1.2 TIMER0 Increment Delay
    - FIGURE 7-4: TIMER0 Timing with External Clock
- 7.2 Prescaler
  - 7.2.1 Switching Prescaler Assignment
8.0 Special Features Of The CPU
- 8.1 Configuration Bits
  - Register 8-1: CONFIG: Configuration Word Register(1)
- 8.2 Oscillator Configurations
- 8.3 Reset
- 8.4 Power-on Reset (POR)
- 8.5 Device Reset Timer (DRT)
  - TABLE 8-5: DRT (Device Reset Timer Period)
- 8.6 Watchdog Timer (WDT)
  - 8.6.1 WDT Period
  - 8.6.2 WDT Programming Considerations
    - FIGURE 8-11: Watchdog Timer Block Diagram
    - TABLE 8-6: Summary of Register Associated with the Watchdog Timer
- 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO, PD, GPWUF)
  - TABLE 8-7: TO/PD/(GPWUF) Status After Reset
- 8.8 Power-down Mode (Sleep)
  - 8.8.1 Sleep
  - 8.8.2 Wake-up from Sleep
- 8.9 Program Verification/Code Protection
- 8.10 ID Locations
- 8.11 In-Circuit Serial Programming™
  - FIGURE 8-12: Typical In-Circuit Serial Programming Connection
9.0 Instruction Set Summary
- TABLE 9-1: Opcode Field Descriptions
- FIGURE 9-1: General Format for Instructions
- TABLE 9-2: Instruction Set Summary
10.0 Development Support
- 10.1 MPLAB Integrated Development Environment Software
- 10.2 MPASM Assembler
- 10.3 MPLAB C18 and MPLAB C30 C Compilers
- 10.4 MPLINK Object Linker/ MPLIB Object Librarian
- 10.5 MPLAB ASM30 Assembler, Linker and Librarian
- 10.6 MPLAB SIM Software Simulator
- 10.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 10.8 MPLAB REAL ICE In-Circuit Emulator System
- 10.9 MPLAB ICD 2 In-Circuit Debugger
- 10.10 MPLAB PM3 Device Programmer
- 10.11 PICSTART Plus Development Programmer
- 10.12 PICkit 2 Development Programmer
- 10.13 Demonstration, Development and Evaluation Boards
11.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
  - FIGURE 11-1: PIC12F519 Voltage-Frequency Graph, -40°C £ ta £ +125°C
  - FIGURE 11-2: Maximum Oscillator Frequency Table
- 11.1 DC Characteristics
- 11.2 Timing Parameter Symbology and Load Conditions – PIC12F519
  - FIGURE 11-3: Load Conditions – PIC12F519
  - FIGURE 11-4: External Clock Timing – PIC12F519
- 11.3 AC Characteristics
12.0 DC and AC Characteristics Graphs and Charts
- FIGURE 12-1: Typical Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-2: Maximum Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-3: Idd vs. Vdd over fosc (LP Mode)
- FIGURE 12-4: Typical Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-5: Maximum Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-6: Typical WDT Ipd VS. Vdd
- FIGURE 12-7: Maximum WDT Ipd VS. Vdd Over Temperature
- FIGURE 12-8: WDT TIME-OUT VS. Vdd Over Temperature (No Prescaler)
- FIGURE 12-9: Vol VS. Iol Over Temperature (Vdd = 3.0V)
- FIGURE 12-10: Vol VS. Iol Over Temperature (Vdd = 5.0V)
- FIGURE 12-11: Voh VS. Ioh Over Temperature (Vdd = 3.0V)
- FIGURE 12-12: Voh VS. Ioh Over Temperature (Vdd = 5.0V)
- FIGURE 12-13: TTL Input Threshold Vin VS. Vdd
- FIGURE 12-14: Schmitt Trigger Input Threshold Vin VS. Vdd
- FIGURE 12-15: Device Reset Timer (XT and LP) vs. Vdd
13.0 Packaging Information
- 13.1 Package Marking Information
Appendix A: Revision History
INDEX
The Microchip Web Site
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PIC12F519

11.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

(†)

Ambient temperature under bias.......................................................................................................... -40°C to +125°C

Storage temperature ............................................................................................................................-65°C to +150°C

Voltage on V

DD with respect to VSS ...............................................................................................................0 to +6.5V

Voltage on MCLR

with respect to VSS..........................................................................................................0 to +13.5V

Voltage on all other pins with respect to V

SS ............................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation

(1)

..................................................................................................................................700 mW

Max. current out of V

SS pin ................................................................................................................................200 mA

Max. current into V

DD pin ................................................................................................................................... 150 mA

Input clamp current, I

IK (VI < 0 or VI > VDD)...................................................................................................................±20 mA

Output clamp current, I

OK (VO < 0 or VO > VDD) ...........................................................................................................±20 mA

Max. output current sunk by any I/O pin ..............................................................................................................25 mA

Max. output current sourced by any I/O pin ......................................................................................................... 25 mA

Max. output current sourced by I/O port .............................................................................................................. 75 mA

Max. output current sunk by I/O port ................................................................................................................... 75 mA

Note 1: Power dissipation is calculated as follows: P

DIS = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)

†

NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.