Datasheet
Table Of Contents
- High-Performance RISC CPU:
- Special Microcontroller Features:
- Low-Power Features/CMOS Technology:
- Peripheral Features:
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 General Description
- 2.0 PIC12F519 Device Varieties
- 3.0 Architectural Overview
- 4.0 Memory Organization
- 5.0 Flash Data Memory Control
- 6.0 I/O Port
- 7.0 Timer0 Module and TMR0 Register
- 8.0 Special Features Of The CPU
- 8.1 Configuration Bits
- 8.2 Oscillator Configurations
- 8.3 Reset
- 8.4 Power-on Reset (POR)
- 8.5 Device Reset Timer (DRT)
- 8.6 Watchdog Timer (WDT)
- 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO, PD, GPWUF)
- 8.8 Power-down Mode (Sleep)
- 8.9 Program Verification/Code Protection
- 8.10 ID Locations
- 8.11 In-Circuit Serial Programming™
- 9.0 Instruction Set Summary
- 10.0 Development Support
- 10.1 MPLAB Integrated Development Environment Software
- 10.2 MPASM Assembler
- 10.3 MPLAB C18 and MPLAB C30 C Compilers
- 10.4 MPLINK Object Linker/ MPLIB Object Librarian
- 10.5 MPLAB ASM30 Assembler, Linker and Librarian
- 10.6 MPLAB SIM Software Simulator
- 10.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 10.8 MPLAB REAL ICE In-Circuit Emulator System
- 10.9 MPLAB ICD 2 In-Circuit Debugger
- 10.10 MPLAB PM3 Device Programmer
- 10.11 PICSTART Plus Development Programmer
- 10.12 PICkit 2 Development Programmer
- 10.13 Demonstration, Development and Evaluation Boards
- 11.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 11.1 DC Characteristics
- 11.2 Timing Parameter Symbology and Load Conditions – PIC12F519
- 11.3 AC Characteristics
- TABLE 11-5: External Clock Timing Requirements
- TABLE 11-6: Calibrated Internal RC Frequencies
- FIGURE 11-5: I/O Timing
- TABLE 11-7: Timing Requirements
- FIGURE 11-6: Reset, Watchdog Timer and Device Reset Timer Timing
- TABLE 11-8: Reset, Watchdog Timer and Device Reset Timer – PIC12F519
- TABLE 11-9: DRT (Device Reset Timer Period)
- FIGURE 11-7: Timer0 Clock Timings
- TABLE 11-10: Timer0 Clock Requirements
- TABLE 11-11: Flash Data Memory Write/Erase Requirements
- 12.0 DC and AC Characteristics Graphs and Charts
- FIGURE 12-1: Typical Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-2: Maximum Idd vs. Fosc Over Vdd (XT, EXTRC mode)
- FIGURE 12-3: Idd vs. Vdd over fosc (LP Mode)
- FIGURE 12-4: Typical Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-5: Maximum Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 12-6: Typical WDT Ipd VS. Vdd
- FIGURE 12-7: Maximum WDT Ipd VS. Vdd Over Temperature
- FIGURE 12-8: WDT TIME-OUT VS. Vdd Over Temperature (No Prescaler)
- FIGURE 12-9: Vol VS. Iol Over Temperature (Vdd = 3.0V)
- FIGURE 12-10: Vol VS. Iol Over Temperature (Vdd = 5.0V)
- FIGURE 12-11: Voh VS. Ioh Over Temperature (Vdd = 3.0V)
- FIGURE 12-12: Voh VS. Ioh Over Temperature (Vdd = 5.0V)
- FIGURE 12-13: TTL Input Threshold Vin VS. Vdd
- FIGURE 12-14: Schmitt Trigger Input Threshold Vin VS. Vdd
- FIGURE 12-15: Device Reset Timer (XT and LP) vs. Vdd
- 13.0 Packaging Information
- Appendix A: Revision History
- INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
- Worldwide Sales
© 2008 Microchip Technology Inc. DS41319B-page 1
PIC12F519
High-Performance RISC CPU:
• Only 33 Single-Word Instructions
• All Single-Cycle Instructions except for Program
Branches which are Two-Cycle
• Two-Level Deep Hardware Stack
• Direct, Indirect and Relative Addressing modes
for Data and Instructions
• Operating Speed:
- DC – 8 MHz Oscillator
- DC – 500 ns instruction cycle
• On-chip Flash Program Memory
- 1024 x 12
• General Purpose Registers (SRAM)
- 41 x 8
• Flash Data Memory
- 64 x 8
Special Microcontroller Features:
• 8 MHz Precision Internal Oscillator
- Factory calibrated to ±1%
• In-Circuit Serial Programming™ (ICSP™)
• In-Circuit Debugging (ICD) Support
• Power-on Reset (POR)
• Device Reset Timer (DRT)
• Watchdog Timer (WDT) with Dedicated On-Chip
RC Oscillator for Reliable Operation
• Programmable Code Protection
• Multiplexed MCLR
Input Pin
• Internal Weak Pull-ups on I/O Pins
• Power-Saving Sleep mode
• Wake-up from Sleep on Pin Change
• Selectable Oscillator Options:
- INTRC: 4 MHz or 8 MHz precision Internal
RC oscillator
- EXTRC: External low-cost RC oscillator
- XT: Standard crystal/resonator
- LP: Power-saving, low-frequency crystal
Low-Power Features/CMOS Technology:
• Standby Current:
- 100 nA @ 2.0V, typical
• Operating Current:
-11μA @ 32 kHz, 2.0V, typical
-175μA @ 4 MHz, 2.0V, typical
• Watchdog Timer Current:
-1μA @ 2.0V, typical
-7μA @ 5.0V, typical
• High Endurance Program and Flash Data Memory
Cells
- 100,000 write Program Memory endurance
- 1,000,000 write Flash Data Memory endurance
- Program and Flash Data retention: >40 years
• Fully Static Design
• Wide Operating Voltage Range: 2.0V to 5.5V
- Wide temperature range
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Peripheral Features:
• 6 I/O Pins
- 5 I/O pins with individual direction control
- 1 input-only pin
- High current sink/source for direct LED drive
• 8-bit Real-Time Clock/Counter (TMR0) with 8-bit
Programmable Prescaler.
8-Pin, 8-Bit Flash Microcontroller