Datasheet

© 2009 Microchip Technology Inc. DS41236E-page 91
PIC12F508/509/16F505
12.0 PACKAGING INFORMATION
12.1 Package Marking Information
8-Lead SOIC (3.90 mm)
XXXXXXXX
XXXXYYWW
NNN
Example
12F509-I
/SN 0610
017
8-Lead MSOP
XXXXXX
YWWNNN
Example
12F509
0610017
3
e
X X X
Y W W
N N
8-Lead 2x3 DFN*
B E Q
6 1 0
1 7
Example
XXXXXNNN
8-Lead PDIP
XXXXXXXX
YYWW
/P 017
Example
12F508-I
0610
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard PIC
®
device marking consists of Microchip part number, year code, week code, and traceability
code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
3
e
3
e