Datasheet

© 2009 Microchip Technology Inc. DS41236E-page 109
PIC12F508/509/16F505
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX XXX
PatternPackageTemperature
Range
Device
Device: PIC16F505
PIC12F508
PIC12F509
PIC16F505T
(1)
PIC12F508T
(2)
PIC12F509T
(2)
Temperature
Range:
I= -40°C to +85°C (Industrial)
E= -40°C to +125°C (Extended)
Package: MC = 8L DFN 2x3 (DUAL Flatpack No-Leads)
(3, 4)
MS = Micro-Small Outline Package (MSOP)
(3, 4)
P = Plastic (PDIP)
(4)
SL = 14L Small Outline, 3.90 mm (SOIC)
(4)
SN = 8L Small Outline, 3.90 mm Narrow (SOIC)
(4)
ST = Thin Shrink Small Outline (TSSOP)
(4)
MG = 16L QFN (3x3x0.9)
(5)
Pattern: Special Requirements
Examples:
a) PIC12F508-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
b) PIC12F508-I/SN = Industrial Temp., SOIC
package
c) PIC12F508T-E/P = Extended Temp., PDIP
package, Tape and Reel
Note 1: T = in tape and reel SOIC, TSSOP and
QFN packages only
2: T = in tape and reel SOIC and MSOP
packages only.
3: PIC12F508/PIC12F509 only.
4: Pb-free.
5: PIC16F505 only.
Note: Tape and Reel available for only the following packages: SOIC, MSOP
and TSSOP.