Datasheet

 2013-2015 Microchip Technology Inc. DS40001723D-page 325
PIC12(L)F1571/2
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
2.40
1.60
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.35
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2254A
NOM
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]
SILK SCREEN
CContact Pad Spacing 2.90
Contact Pad to Center Pad (X8) G2 0.30
C
X2
X1
E
Y2
G2
Y1
Contact Pad to Contact Pad (X6) G1 0.20
G1