Datasheet

PIC12(L)F1571/2
DS40001723D-page 324  2013-2015 Microchip Technology Inc.
Microchip Technology Drawing C04-254A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.065 REF
1.40
2.20
0.35
0.25
0.45
0.00
0.30
3.00 BSC
0.45
2.30
1.50
0.50
0.02
3.00 BSC
MILLIMETERS
MIN
NOM
8
1.60
2.40
0.55
0.35
0.55
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]