Datasheet

 2013-2015 Microchip Technology Inc. DS40001723D-page 323
PIC12(L)F1571/2
B
A
0.10
C
0.10
C
0.10 C A B
(DATUM B)
(DATUM A)
C
SEATING
PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
12
N
0.10 C A B
0.10 C A B
0.05
C
0.05
C
Microchip Technology Drawing C04-254A Sheet 1 of 2
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]
2X
8X
D
E
A
(A3)
A1
NOTE 1
D2
E2
8X be
K
L
e
2
12
N