Datasheet
PIC12(L)F1571/2
DS40001723D-page 312 2013-2015 Microchip Technology Inc.
29.2 Package Details
The following sections give the technical details of the packages.
B
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
eB
E
A
A1
A2
L
8X b
8X b1
D
E1
c
C
PLANE
.010 C
12
N
NOTE 1
TOP VIEW
END VIEWSIDE VIEW
e