Datasheet

PIC12(L)F1571/2
DS40001723D-page 270  2013-2015 Microchip Technology Inc.
TABLE 26-6: THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 56.7 C/W 8-pin DFN 3x3 mm package
89.3
C/W 8-pin PDIP package
149.5
C/W 8-pin SOIC package
39.4
C/W 8-pin UDFN 3x3 mm package
TH02
JC Thermal Resistance Junction to Case 9.0 C/W 8-pin DFN 3x3 mm package
43.1
C/W 8-pin PDIP package
39.9
C/W 8-pin SOIC package
40.3
C/W 8-pin UDFN 3x3 mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD – VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ – TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature; TJ = Junction Temperature.