Datasheet

 2013-2015 Microchip Technology Inc. DS40001723D-page 259
PIC12(L)F1571/2
26.0 ELECTRICAL SPECIFICATIONS
26.1 Absolute Maximum Ratings
(†)
Ambient temperature under bias............................................................................................................ -40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on pins with respect to VSS:
on V
DD pin
PIC12F1571/2 ................................................................................................................. -0.3V to +6.5V
PIC12LF1571/2 ............................................................................................................... -0.3V to +4.0V
on MCLR
pin ................................................................................................................................. -0.3V to +9.0V
on all other pins .................................................................................................................. -0.3V to (V
DD + 0.3V)
Maximum current:
on VSS pin
(1)
-40°C  TA  +85°C .................................................................................................................... 250 mA
+85°C  T
A  +125°C ................................................................................................................... 85 mA
on V
DD pin
(1)
-40°C  TA  +85°C .................................................................................................................... 250 mA
+85°C  T
A  +125°C ................................................................................................................... 85 mA
Sunk by any standard I/O pin ..................................................................................................................... 50 mA
Sourced by any standard I/O pin ................................................................................................................ 50 mA
Clamp current, I
K (VPIN < 0 or VPIN > VDD) ......................................................................................................... 20 mA
Total power dissipation
(2)
.....................................................................................................................................800 mW
Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Table 26- 6: “Thermal
Characteristics” to calculate device specifications.
2: Power dissipation is calculated as follows: P
DIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.