Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller MSOP 8 8-Bit 20 MHz I/O number 5

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Table Of Contents

High-Performance RISC CPU:
Flexible Oscillator Structure:
Special Microcontroller Features:
Low-Power Features (PIC12LF1501):
Peripheral Features:
Peripheral Features (Continued):
PIC12(L)F1501/PIC16(L)F150X Family Types
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 Device Overview
- TABLE 1-1: Device Peripheral Summary
- FIGURE 1-1: PIC12(L)F1501 Block Diagram
- TABLE 1-2: PIC12(L)F1501 Pinout Description
2.0 Enhanced Mid-Range CPU
- 2.1 Automatic Interrupt Context Saving
- 2.2 16-level Stack with Overflow and Underflow
- 2.3 File Select Registers
- 2.4 Instruction Set
  - FIGURE 2-1: Core Block Diagram
3.0 Memory Organization
- 3.1 Program Memory Organization
- 3.2 Data Memory Organization
- 3.3 PCL and PCLATH
- 3.4 Stack
  - 3.4.1 Accessing the Stack
  - 3.4.2 Overflow/Underflow Reset
- 3.5 Indirect Addressing
4.0 Device Configuration
- 4.1 Configuration Words
  - Register 4-1: CONFIG1: Configuration Word 1
  - Register 4-2: CONFIG2: Configuration Word 2
- 4.2 Code Protection
  - 4.2.1 Program Memory Protection
- 4.3 Write Protection
- 4.4 User ID
- 4.5 Device ID and Revision ID
  - Register 4-3: DEVICEID: Device ID Register
5.0 Oscillator Module
- 5.1 Overview
  - FIGURE 5-1: Simplified PIC® MCU Clock Source Block Diagram
- 5.2 Clock Source Types
  - 5.2.1 External Clock Sources
    - FIGURE 5-2: External Clock (EC) Mode Operation
  - 5.2.2 Internal Clock Sources
    - FIGURE 5-3: Internal Oscillator Switch Timing
- 5.3 Clock Switching
  - 5.3.1 System Clock Select (SCS) BitS
    - TABLE 5-1: Oscillator Switching Delays
- 5.4 Oscillator Control Registers
6.0 Resets
- FIGURE 6-1: Simplified Block Diagram Of On-Chip Reset Circuit
- 6.1 Power-on Reset (POR)
  - 6.1.1 Power-up Timer (PWRT)
- 6.2 Brown-Out Reset (BOR)
- 6.3 Low-Power Brown-out Reset (LPBOR)
  - 6.3.1 Enabling LPBOR
- 6.4 MCLR
- 6.5 Watchdog Timer (WDT) Reset
- 6.6 RESET Instruction
- 6.7 Stack Overflow/Underflow Reset
- 6.8 Programming Mode Exit
- 6.9 Power-Up Timer
- 6.10 Start-up Sequence
  - FIGURE 6-3: Reset Start-Up Sequence
- 6.11 Determining the Cause of a Reset
  - TABLE 6-3: Reset Status Bits and Their Significance
  - TABLE 6-4: Reset Condition for Special Registers(2)
- 6.12 Power Control (PCON) Register
7.0 Interrupts
- FIGURE 7-1: Interrupt Logic
- 7.1 Operation
- 7.2 Interrupt Latency
  - FIGURE 7-2: Interrupt Latency
  - FIGURE 7-3: INT Pin Interrupt Timing
- 7.3 Interrupts During Sleep
- 7.4 INT Pin
- 7.5 Automatic Context Saving
- 7.6 Interrupt Control Registers
8.0 Power-Down Mode (Sleep)
- 8.1 Wake-up from Sleep
  - 8.1.1 Wake-up Using Interrupts
    - FIGURE 8-1: Wake-Up From Sleep Through Interrupt
- 8.2 Low-Power Sleep Mode
  - 8.2.1 Sleep Current vs. Wake-up Time
  - 8.2.2 Peripheral Usage in Sleep
    - Register 8-1: VREGCON: Voltage Regulator Control Register(1)
    - TABLE 8-1: Summary of Registers Associated with Power-Down Mode
9.0 Watchdog Timer
- FIGURE 9-1: Watchdog Timer Block Diagram
- 9.1 Independent Clock Source
- 9.2 WDT Operating Modes
- 9.3 Time-Out Period
- 9.4 Clearing the WDT
- 9.5 Operation During Sleep
  - TABLE 9-2: WDT Clearing Conditions
- 9.6 Watchdog Control Register
10.0 Flash Program Memory Control
- 10.1 PMADRL and PMADRH Registers
  - 10.1.1 PMCON1 and PMCON2 Registers
- 10.2 Flash Program Memory Overview
- 10.3 Modifying Flash Program Memory
  - FIGURE 10-7: Flash Program Memory Modify Flowchart
- 10.4 User ID, Device ID and Configuration Word Access
  - TABLE 10-2: User ID, Device ID and Configuration Word Access (cfgs = 1)
  - EXAMPLE 10-4: Configuration Word and Device ID Access
- 10.5 Write Verify
  - FIGURE 10-8: Flash Program Memory Verify Flowchart
- 10.6 Flash Program Memory Control Registers
11.0 I/O Ports
- TABLE 11-1: Port Availability Per Device
- FIGURE 11-1: Generic I/O Port Operation
- EXAMPLE 11-1: Initializing PORTA
- 11.1 Alternate Pin Function
  - Register 11-1: APFCON: Alternate Pin Function Control Register
- 11.2 PORTA Registers
  - 11.2.1 ANSELA Register
  - 11.2.2 PORTA Functions and Output Priorities
12.0 Interrupt-On-Change
- 12.1 Enabling the Module
- 12.2 Individual Pin Configuration
- 12.3 Interrupt Flags
- 12.4 Clearing Interrupt Flags
  - EXAMPLE 12-1: Clearing Interrupt Flags (PORTA Example)
- 12.5 Operation in Sleep
  - FIGURE 12-1: Interrupt-On-Change Block Diagram (PORTA Example)
- 12.6 Interrupt-On-Change Registers
13.0 Fixed Voltage Reference (FVR)
- 13.1 Independent Gain Amplifier
- 13.2 FVR Stabilization Period
  - FIGURE 13-1: Voltage Reference Block Diagram
  - TABLE 13-1: Peripherals Requiring the Fixed Voltage Reference (FVR)
- 13.3 FVR Control Registers
  - Register 13-1: FVRCON: Fixed Voltage Reference Control Register
  - TABLE 13-2: Summary of Registers Associated with the Fixed Voltage Reference
14.0 Temperature Indicator Module
- 14.1 Circuit Operation
  - EQUATION 14-1: Vout Ranges
  - FIGURE 14-1: Temperature Circuit Diagram
- 14.2 Minimum Operating Vdd
  - TABLE 14-1: Recommended Vdd vs. Range
- 14.3 Temperature Output
- 14.4 ADC Acquisition Time
  - TABLE 14-2: Summary of Registers Associated with the Temperature Indicator
15.0 Analog-to-Digital Converter (ADC) Module
- FIGURE 15-1: ADC Block Diagram
- 15.1 ADC Configuration
- 15.2 ADC Operation
- 15.3 A/D Acquisition Requirements
16.0 Digital-to-Analog Converter (DAC) Module
- 16.1 Output Voltage Selection
  - EQUATION 16-1: DAC Output Voltage
- 16.2 Ratiometric Output Level
- 16.3 DAC Voltage Reference Output
  - FIGURE 16-1: Digital-to-Analog Converter Block Diagram
  - FIGURE 16-2: Voltage Reference Output Buffer Example
- 16.4 Operation During Sleep
- 16.5 Effects of a Reset
- 16.6 DAC Control Registers
17.0 Comparator Module
- 17.1 Comparator Overview
- 17.2 Comparator Control
- 17.3 Comparator Hysteresis
- 17.4 Timer1 Gate Operation
  - 17.4.1 Comparator Output Synchronization
- 17.5 Comparator Interrupt
- 17.6 Comparator Positive Input Selection
- 17.7 Comparator Negative Input Selection
- 17.8 Comparator Response Time
- 17.9 Analog Input Connection Considerations
18.0 Timer0 Module
- 18.1 Timer0 Operation
- 18.2 Option and Timer0 Control Register
  - Register 18-1: OPTION_REG: OPTION Register
  - TABLE 18-1: Summary of Registers Associated with Timer0
19.0 Timer1 Module with Gate Control
- FIGURE 19-1: Timer1 Block Diagram
- 19.1 Timer1 Operation
  - TABLE 19-1: Timer1 Enable Selections
- 19.2 Clock Source Selection
  - 19.2.1 Internal Clock Source
  - 19.2.2 External Clock Source
    - TABLE 19-2: Clock Source Selections
- 19.3 Timer1 Prescaler
- 19.4 Timer1 Operation in Asynchronous Counter Mode
  - 19.4.1 Reading and Writing Timer1 in Asynchronous Counter Mode
- 19.5 Timer1 Gate
- 19.6 Timer1 Interrupt
- 19.7 Timer1 Operation During Sleep
  - 19.7.1 Alternate Pin Locations
- 19.8 Timer1 Control Registers
20.0 Timer2 Module
- FIGURE 20-1: Timer2 Block Diagram
- 20.1 Timer2 Operation
- 20.2 Timer2 Interrupt
- 20.3 Timer2 Output
- 20.4 Timer2 Operation During Sleep
  - Register 20-1: T2CON: Timer2 Control Register
  - TABLE 20-1: Summary of Registers Associated With Timer2
21.0 Pulse-Width Modulation (PWM) Module
- FIGURE 21-1: PWM Output
- FIGURE 21-2: Simplified PWM Block Diagram
- 21.1 PWMx Pin Configuration
- 21.2 PWM Register Definitions
22.0 Configurable Logic Cell (CLC)
- FIGURE 22-1: CLCx Simplified Block Diagram
- 22.1 CLCx Setup
- 22.2 CLCx Interrupts
- 22.3 Output Mirror Copies
- 22.4 Effects of a Reset
- 22.5 Operation During Sleep
- 22.6 Alternate Pin Locations
  - FIGURE 22-2: Input Data Selection and Gating
  - FIGURE 22-3: Programmable Logic Functions
- 22.7 CLCx Control Registers
23.0 Numerically Controlled Oscillator (NCO) Module
- FIGURE 23-1: Numerically Controlled Oscillator (NCOx) Module Simplified Block Diagram
- 23.1 NCOx OPERATION
- 23.2 FIXED DUTY CYCLE (FDC) MODE
- 23.3 PULSE FREQUENCY (PF) MODE
  - 23.3.1 Output Pulse Width Control
- 23.4 OUTPUT POLARITY CONTROL
  - FIGURE 23-2: FDC Output Mode Operation Diagram
- 23.5 Interrupts
- 23.6 Effects of a Reset
- 23.7 Operation In Sleep
- 23.8 Alternate Pin Locations
- 23.9 NCOx Control Registers
24.0 Complementary Waveform Generator (CWG) Module
- FIGURE 24-1: Simplified CWG Block Diagram
- FIGURE 24-2: Typical CWG Operation with PWM1 (no Auto-shutdown)
- 24.1 Fundamental Operation
- 24.2 Clock Source
- 24.3 Selectable Input Sources
- 24.4 Output Control
  - 24.4.1 Output Enables
  - 24.4.2 Polarity Control
- 24.5 Dead-Band Control
- 24.6 Rising Edge Dead Band
- 24.7 Falling Edge Dead Band
- 24.8 Dead-Band Uncertainty
- 24.9 Auto-shutdown Control
  - 24.9.1 SHUTDOWN
- 24.10 Operation During Sleep
- 24.11 Alternate Pin Locations
- 24.12 Configuring the CWG
  - 24.12.1 PIN OVERRIDE LEVELS
  - 24.12.2 AUTO-SHUTDOWN RESTART
    - FIGURE 24-5: SHUTDOWN Functionality, Auto-restart Disabled (GxARSEN = 0,GxASDLA = 01, GxASDLB = 01)
    - FIGURE 24-6: SHUTDOWN Functionality, Auto-restart Enabled (GxARSEN = 1,GxASDLA = 01, GxASDLB = 01)
- 24.13 CWG Control Registers
25.0 In-Circuit Serial Programming™ (ICSP™)
- 25.1 High-Voltage Programming Entry Mode
- 25.2 Low-Voltage Programming Entry Mode
- 25.3 Common Programming Interfaces
26.0 Instruction Set Summary
- 26.1 Read-Modify-Write Operations
- 26.2 Instruction Descriptions
27.0 Electrical Specifications
- Absolute Maximum Ratings(†)
  - FIGURE 27-1: PIC12F1501 Voltage Frequency Graph, -40°C £ Ta £ +125°C
  - FIGURE 27-2: PIC12LF1501 Voltage Frequency Graph, -40°C £ Ta £ +125°C
- 27.1 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
  - FIGURE 27-3: POR and POR Rearm with Slow Rising Vdd
- 27.2 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) (Continued)
- 27.4 DC Characteristics: PIC12(L)F1501-I/E
- 27.5 Memory Programming Requirements
- 27.6 Thermal Considerations
- 27.7 Timing Parameter Symbology
  - FIGURE 27-4: Load Conditions
- 27.8 AC Characteristics: PIC12(L)F1501-I/E
28.0 DC and AC Characteristics Graphs and Charts
- 29.0 Development Support
30.0 Packaging Information
- 30.1 Package Marking Information
- Package Marking Information (Continued)
  - TABLE 30-1: 8-Lead 2X3 Dfn (mc) tOP mARKINg
  - TABLE 30-2: 8-Lead 3X3 Qfn (mF) tOP mARKINg
- 30.2 Package Details
Appendix A: Data Sheet Revision History
- Revision A
INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
Product Identification System
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PIC12(L)F1501

DS41615A-page 238 Preliminary  2011 Microchip Technology Inc.

27.8 AC Characteristics: PIC12(L)F1501-I/E

FIGURE 27-5: CLOCK TIMING

TABLE 27-1: CLOCK OSCILLATOR TIMING REQUIREMENTS

TABLE 27-2: OSCILLATOR PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym. Characteristic Min. Typ† Max. Units Conditions

OS01 FOSC External CLKIN Frequency

(1)

DC — 0.5 MHz EC Oscillator mode (low)

DC — 4 MHz EC Oscillator mode (medium)

DC — 20 MHz EC Oscillator mode (high)

OS02 T

OSC External CLKIN Period

(1)

50 —  ns EC mode

OS03 T

CY Instruction Cycle Time

(1)

200 — DC ns TCY = FOSC/4

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on

characterization data for that particular oscillator type under standard operating conditions with the device executing code.

Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-

sumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external

clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C TA +125°C

Param

No.

Sym. Characteristic

Freq.

Tolerance

Min. Typ† Max. Units Conditions

OS08 HFOSC Internal Calibrated HFINTOSC

Frequency

(1)

10% — 16.0 — MHz 0°C  TA  +85°C

OS09 LF

OSC Internal LFINTOSC Frequency — — 31 — kHz -40°C  TA  +125°C

OS10* T

IOSC ST HFINTOSC

Wake-up from Sleep Start-up Time

——58s

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1

F and 0.01 F values in parallel are recommended.

CLKIN

CLKOUT

Q4 Q1 Q2 Q3 Q4 Q1

OS02

OS03

(CLKOUT Mode)

Note 1: See Table 27-3.

OS11

OS12