Datasheet
Table Of Contents
- High-Performance RISC CPU:
- Flexible Oscillator Structure:
- Special Microcontroller Features:
- Low-Power Features (PIC12LF1501):
- Peripheral Features:
- Peripheral Features (Continued):
- PIC12(L)F1501/PIC16(L)F150X Family Types
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Enhanced Mid-Range CPU
- 3.0 Memory Organization
- 4.0 Device Configuration
- 5.0 Oscillator Module
- 6.0 Resets
- FIGURE 6-1: Simplified Block Diagram Of On-Chip Reset Circuit
- 6.1 Power-on Reset (POR)
- 6.2 Brown-Out Reset (BOR)
- 6.3 Low-Power Brown-out Reset (LPBOR)
- 6.4 MCLR
- 6.5 Watchdog Timer (WDT) Reset
- 6.6 RESET Instruction
- 6.7 Stack Overflow/Underflow Reset
- 6.8 Programming Mode Exit
- 6.9 Power-Up Timer
- 6.10 Start-up Sequence
- 6.11 Determining the Cause of a Reset
- 6.12 Power Control (PCON) Register
- 7.0 Interrupts
- 8.0 Power-Down Mode (Sleep)
- 9.0 Watchdog Timer
- 10.0 Flash Program Memory Control
- 10.1 PMADRL and PMADRH Registers
- 10.2 Flash Program Memory Overview
- 10.3 Modifying Flash Program Memory
- 10.4 User ID, Device ID and Configuration Word Access
- 10.5 Write Verify
- 10.6 Flash Program Memory Control Registers
- Register 10-1: PMDATL: Program Memory Data Low Byte Register
- Register 10-2: PMDATH: Program Memory Data hIGH bYTE Register
- Register 10-3: PMADRL: Program Memory Address Low Byte Register
- Register 10-4: PMADRH: Program Memory Address hIGH bYTE Register
- Register 10-5: PMCON1: Program Memory Control 1 Register
- Register 10-6: PMCON2: Program Memory Control 2 Register
- TABLE 10-3: Summary of Registers Associated with Flash Program Memory
- TABLE 10-4: Summary of Configuration Word with Flash Program Memory
- 11.0 I/O Ports
- TABLE 11-1: Port Availability Per Device
- FIGURE 11-1: Generic I/O Port Operation
- EXAMPLE 11-1: Initializing PORTA
- 11.1 Alternate Pin Function
- 11.2 PORTA Registers
- 11.2.1 ANSELA Register
- 11.2.2 PORTA Functions and Output Priorities
- TABLE 11-2: PORTA Output Priority
- Register 11-2: PORTA: PORTA Register
- Register 11-3: TRISA: PORTA Tri-State Register
- Register 11-4: LATA: PORTA Data Latch Register
- Register 11-5: ANSELA: PORTA Analog Select Register
- Register 11-6: WPUA: Weak Pull-Up PORTA Register
- TABLE 11-3: Summary of Registers Associated with PORTA
- TABLE 11-4: Summary of Configuration Word with PORTA
- 12.0 Interrupt-On-Change
- 13.0 Fixed Voltage Reference (FVR)
- 14.0 Temperature Indicator Module
- 15.0 Analog-to-Digital Converter (ADC) Module
- FIGURE 15-1: ADC Block Diagram
- 15.1 ADC Configuration
- 15.2 ADC Operation
- 15.2.1 Starting a Conversion
- 15.2.2 Completion of a Conversion
- 15.2.3 Terminating a conversion
- 15.2.4 ADC Operation During Sleep
- 15.2.5 Auto-Conversion Trigger
- 15.2.6 A/D Conversion Procedure
- 15.2.7 ADC Register Definitions
- Register 15-1: ADCON0: A/D Control Register 0
- Register 15-2: ADCON1: A/D Control Register 1
- Register 15-3: ADCON2: A/D Control Register 2
- Register 15-4: ADRESH: ADC Result Register High (ADRESH) ADFM = 0
- Register 15-5: ADRESL: ADC Result Register Low (ADRESL) ADFM = 0
- Register 15-6: ADRESH: ADC Result Register High (ADRESH) ADFM = 1
- Register 15-7: ADRESL: ADC Result Register Low (ADRESL) ADFM = 1
- 15.3 A/D Acquisition Requirements
- 16.0 Digital-to-Analog Converter (DAC) Module
- 17.0 Comparator Module
- 18.0 Timer0 Module
- 19.0 Timer1 Module with Gate Control
- 20.0 Timer2 Module
- 21.0 Pulse-Width Modulation (PWM) Module
- FIGURE 21-1: PWM Output
- FIGURE 21-2: Simplified PWM Block Diagram
- 21.1 PWMx Pin Configuration
- 21.2 PWM Register Definitions
- 22.0 Configurable Logic Cell (CLC)
- FIGURE 22-1: CLCx Simplified Block Diagram
- 22.1 CLCx Setup
- 22.2 CLCx Interrupts
- 22.3 Output Mirror Copies
- 22.4 Effects of a Reset
- 22.5 Operation During Sleep
- 22.6 Alternate Pin Locations
- 22.7 CLCx Control Registers
- Register 22-1: CLCxCON: Configurable Logic CELL Control Register
- Register 22-2: CLCxPOL: Signal Polarity Control Register
- Register 22-3: CLCxSEL0: MULTIPLEXER DATA 1 and 2 SELECT Register
- Register 22-4: CLCxSEL1: MULTIPLEXER DATA 3 and 4 SELECT Register
- Register 22-5: CLCxGLS0: Gate 1 Logic Select Register
- Register 22-6: CLCxGLS1: Gate 2 Logic Select Register
- Register 22-7: CLCxGLS2: Gate 3 Logic Select Register
- Register 22-8: CLCxGLS3: Gate 4 Logic Select Register
- Register 22-9: CLCDATA: CLC Data Output
- TABLE 22-3: Summary Of Registers Associated With CLCx
- 23.0 Numerically Controlled Oscillator (NCO) Module
- FIGURE 23-1: Numerically Controlled Oscillator (NCOx) Module Simplified Block Diagram
- 23.1 NCOx OPERATION
- 23.2 FIXED DUTY CYCLE (FDC) MODE
- 23.3 PULSE FREQUENCY (PF) MODE
- 23.4 OUTPUT POLARITY CONTROL
- 23.5 Interrupts
- 23.6 Effects of a Reset
- 23.7 Operation In Sleep
- 23.8 Alternate Pin Locations
- 23.9 NCOx Control Registers
- Register 23-1: NCOxCON: NCOx Control Register
- Register 23-2: NCOxCLK: NCOx Input Clock Control Register
- Register 23-3: NCOxACCL: NCOx Accumulator Register – Low Byte
- Register 23-4: NCOxACCH: NCOx Accumulator Register – High Byte
- Register 23-5: NCOxACCU: NCOx Accumulator Register – Upper Byte
- Register 23-6: NCOxINCL: NCOx Increment Register – Low Byte
- Register 23-7: NCOxINCH: NCOx Increment Register – High Byte
- TABLE 23-1: Summary of Registers Associated with NCOx
- 24.0 Complementary Waveform Generator (CWG) Module
- FIGURE 24-1: Simplified CWG Block Diagram
- FIGURE 24-2: Typical CWG Operation with PWM1 (no Auto-shutdown)
- 24.1 Fundamental Operation
- 24.2 Clock Source
- 24.3 Selectable Input Sources
- 24.4 Output Control
- 24.5 Dead-Band Control
- 24.6 Rising Edge Dead Band
- 24.7 Falling Edge Dead Band
- 24.8 Dead-Band Uncertainty
- 24.9 Auto-shutdown Control
- 24.10 Operation During Sleep
- 24.11 Alternate Pin Locations
- 24.12 Configuring the CWG
- 24.13 CWG Control Registers
- Register 24-1: CWGxCON0: CWG Control Register 0
- Register 24-2: CWGxCON1: CWG Control Register 1
- Register 24-3: CWGXCON2: CWG Control Register 2
- Register 24-4: CWGxDBR: Complementary Waveform Generator (CWGx) Rising Dead-band Count Register
- Register 24-5: CWGxdbf: Complementary Waveform Generator (CWGx) Falling Dead-Band Count Register
- 24.13.1 Alternate Pin Locations
- 25.0 In-Circuit Serial Programming™ (ICSP™)
- 26.0 Instruction Set Summary
- 27.0 Electrical Specifications
- Absolute Maximum Ratings(†)
- 27.1 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
- 27.2 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) (Continued)
- 27.4 DC Characteristics: PIC12(L)F1501-I/E
- 27.5 Memory Programming Requirements
- 27.6 Thermal Considerations
- 27.7 Timing Parameter Symbology
- 27.8 AC Characteristics: PIC12(L)F1501-I/E
- FIGURE 27-5: Clock Timing
- TABLE 27-1: Clock Oscillator Timing Requirements
- TABLE 27-2: Oscillator Parameters
- FIGURE 27-6: CLKOUT and I/O Timing
- TABLE 27-3: CLKOUT and I/O Timing Parameters
- FIGURE 27-7: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 27-8: Brown-Out Reset Timing and Characteristics
- TABLE 27-4: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-Out Reset Parameters
- FIGURE 27-9: Timer0 and Timer1 External Clock Timings
- TABLE 27-5: Timer0 and Timer1 External Clock Requirements
- TABLE 27-6: PIC12(L)F1501 A/D Converter (ADC) Characteristics:
- TABLE 27-7: PIC12(L)F1501 A/D Conversion Requirements
- FIGURE 27-10: PIC12(L)F1501 A/D Conversion Timing (Normal Mode)
- FIGURE 27-11: PIC12(L)F1501 A/D Conversion Timing (Sleep Mode)
- TABLE 27-8: Comparator Specifications
- TABLE 27-9: Digital-to-Analog Converter (DAC) Specifications
- 28.0 DC and AC Characteristics Graphs and Charts
- 30.0 Packaging Information
- Appendix A: Data Sheet Revision History
- INDEX
- Product Identification System
- Worldwide Sales and Service

PIC12(L)F1501
DS41615A-page 234 Preliminary 2011 Microchip Technology Inc.
27.4 DC Characteristics: PIC12(L)F1501-I/E
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C
TA +125°C for extended
Param
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O PORT:
D030 with TTL buffer — — 0.8 V 4.5V
VDD 5.5V
D030A — — 0.15 V
DD V1.8V VDD 4.5V
D031 with Schmitt Trigger buffer — — 0.2 V
DD V2.0V VDD 5.5V
D032 MCLR
——0.2VDD V
V
IH Input High Voltage
I/O ports: — —
D040 with TTL buffer 2.0 — — V 4.5V
VDD 5.5V
D040A 0.25 V
DD +
0.8
——V1.8V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 V
DD ——V2.0V VDD 5.5V
D042 MCLR
0.8 VDD ——V
I
IL Input Leakage Current
(1)
D060 I/O ports — ± 5
± 5
± 125
± 1000
nA
nA
VSS VPIN VDD, Pin at high-
impedance at 85°C
125°C
D061 MCLR
(2)
—± 50± 200nAVSS VPIN VDD at 85°C
I
PUR Weak Pull-up Current
D070* 25
25
100
140
200
300
A
V
DD = 3.3V, VPIN = VSS
VDD = 5.0V, VPIN = VSS
VOL Output Low Voltage
(3)
D080 I/O ports
——0.6V
IOL = 8mA, VDD = 5V
I
OL = 6mA, VDD = 3.3V
I
OL = 1.8mA, VDD = 1.8V
V
OH Output High Voltage
(3)
D090 I/O ports
V
DD - 0.7 — — V
I
OH = 3.5mA, VDD = 5V
I
OH = 3mA, VDD = 3.3V
I
OH = 1mA, VDD = 1.8V
Capacitive Loading Specs on Output Pins
D101A* CIO All I/O pins — — 50 pF
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Including OSC2 in CLKOUT mode.