Datasheet
Table Of Contents
- High-Performance RISC CPU:
- Flexible Oscillator Structure:
- Special Microcontroller Features:
- Low-Power Features (PIC12LF1501):
- Peripheral Features:
- Peripheral Features (Continued):
- PIC12(L)F1501/PIC16(L)F150X Family Types
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Enhanced Mid-Range CPU
- 3.0 Memory Organization
- 4.0 Device Configuration
- 5.0 Oscillator Module
- 6.0 Resets
- FIGURE 6-1: Simplified Block Diagram Of On-Chip Reset Circuit
- 6.1 Power-on Reset (POR)
- 6.2 Brown-Out Reset (BOR)
- 6.3 Low-Power Brown-out Reset (LPBOR)
- 6.4 MCLR
- 6.5 Watchdog Timer (WDT) Reset
- 6.6 RESET Instruction
- 6.7 Stack Overflow/Underflow Reset
- 6.8 Programming Mode Exit
- 6.9 Power-Up Timer
- 6.10 Start-up Sequence
- 6.11 Determining the Cause of a Reset
- 6.12 Power Control (PCON) Register
- 7.0 Interrupts
- 8.0 Power-Down Mode (Sleep)
- 9.0 Watchdog Timer
- 10.0 Flash Program Memory Control
- 10.1 PMADRL and PMADRH Registers
- 10.2 Flash Program Memory Overview
- 10.3 Modifying Flash Program Memory
- 10.4 User ID, Device ID and Configuration Word Access
- 10.5 Write Verify
- 10.6 Flash Program Memory Control Registers
- Register 10-1: PMDATL: Program Memory Data Low Byte Register
- Register 10-2: PMDATH: Program Memory Data hIGH bYTE Register
- Register 10-3: PMADRL: Program Memory Address Low Byte Register
- Register 10-4: PMADRH: Program Memory Address hIGH bYTE Register
- Register 10-5: PMCON1: Program Memory Control 1 Register
- Register 10-6: PMCON2: Program Memory Control 2 Register
- TABLE 10-3: Summary of Registers Associated with Flash Program Memory
- TABLE 10-4: Summary of Configuration Word with Flash Program Memory
- 11.0 I/O Ports
- TABLE 11-1: Port Availability Per Device
- FIGURE 11-1: Generic I/O Port Operation
- EXAMPLE 11-1: Initializing PORTA
- 11.1 Alternate Pin Function
- 11.2 PORTA Registers
- 11.2.1 ANSELA Register
- 11.2.2 PORTA Functions and Output Priorities
- TABLE 11-2: PORTA Output Priority
- Register 11-2: PORTA: PORTA Register
- Register 11-3: TRISA: PORTA Tri-State Register
- Register 11-4: LATA: PORTA Data Latch Register
- Register 11-5: ANSELA: PORTA Analog Select Register
- Register 11-6: WPUA: Weak Pull-Up PORTA Register
- TABLE 11-3: Summary of Registers Associated with PORTA
- TABLE 11-4: Summary of Configuration Word with PORTA
- 12.0 Interrupt-On-Change
- 13.0 Fixed Voltage Reference (FVR)
- 14.0 Temperature Indicator Module
- 15.0 Analog-to-Digital Converter (ADC) Module
- FIGURE 15-1: ADC Block Diagram
- 15.1 ADC Configuration
- 15.2 ADC Operation
- 15.2.1 Starting a Conversion
- 15.2.2 Completion of a Conversion
- 15.2.3 Terminating a conversion
- 15.2.4 ADC Operation During Sleep
- 15.2.5 Auto-Conversion Trigger
- 15.2.6 A/D Conversion Procedure
- 15.2.7 ADC Register Definitions
- Register 15-1: ADCON0: A/D Control Register 0
- Register 15-2: ADCON1: A/D Control Register 1
- Register 15-3: ADCON2: A/D Control Register 2
- Register 15-4: ADRESH: ADC Result Register High (ADRESH) ADFM = 0
- Register 15-5: ADRESL: ADC Result Register Low (ADRESL) ADFM = 0
- Register 15-6: ADRESH: ADC Result Register High (ADRESH) ADFM = 1
- Register 15-7: ADRESL: ADC Result Register Low (ADRESL) ADFM = 1
- 15.3 A/D Acquisition Requirements
- 16.0 Digital-to-Analog Converter (DAC) Module
- 17.0 Comparator Module
- 18.0 Timer0 Module
- 19.0 Timer1 Module with Gate Control
- 20.0 Timer2 Module
- 21.0 Pulse-Width Modulation (PWM) Module
- FIGURE 21-1: PWM Output
- FIGURE 21-2: Simplified PWM Block Diagram
- 21.1 PWMx Pin Configuration
- 21.2 PWM Register Definitions
- 22.0 Configurable Logic Cell (CLC)
- FIGURE 22-1: CLCx Simplified Block Diagram
- 22.1 CLCx Setup
- 22.2 CLCx Interrupts
- 22.3 Output Mirror Copies
- 22.4 Effects of a Reset
- 22.5 Operation During Sleep
- 22.6 Alternate Pin Locations
- 22.7 CLCx Control Registers
- Register 22-1: CLCxCON: Configurable Logic CELL Control Register
- Register 22-2: CLCxPOL: Signal Polarity Control Register
- Register 22-3: CLCxSEL0: MULTIPLEXER DATA 1 and 2 SELECT Register
- Register 22-4: CLCxSEL1: MULTIPLEXER DATA 3 and 4 SELECT Register
- Register 22-5: CLCxGLS0: Gate 1 Logic Select Register
- Register 22-6: CLCxGLS1: Gate 2 Logic Select Register
- Register 22-7: CLCxGLS2: Gate 3 Logic Select Register
- Register 22-8: CLCxGLS3: Gate 4 Logic Select Register
- Register 22-9: CLCDATA: CLC Data Output
- TABLE 22-3: Summary Of Registers Associated With CLCx
- 23.0 Numerically Controlled Oscillator (NCO) Module
- FIGURE 23-1: Numerically Controlled Oscillator (NCOx) Module Simplified Block Diagram
- 23.1 NCOx OPERATION
- 23.2 FIXED DUTY CYCLE (FDC) MODE
- 23.3 PULSE FREQUENCY (PF) MODE
- 23.4 OUTPUT POLARITY CONTROL
- 23.5 Interrupts
- 23.6 Effects of a Reset
- 23.7 Operation In Sleep
- 23.8 Alternate Pin Locations
- 23.9 NCOx Control Registers
- Register 23-1: NCOxCON: NCOx Control Register
- Register 23-2: NCOxCLK: NCOx Input Clock Control Register
- Register 23-3: NCOxACCL: NCOx Accumulator Register – Low Byte
- Register 23-4: NCOxACCH: NCOx Accumulator Register – High Byte
- Register 23-5: NCOxACCU: NCOx Accumulator Register – Upper Byte
- Register 23-6: NCOxINCL: NCOx Increment Register – Low Byte
- Register 23-7: NCOxINCH: NCOx Increment Register – High Byte
- TABLE 23-1: Summary of Registers Associated with NCOx
- 24.0 Complementary Waveform Generator (CWG) Module
- FIGURE 24-1: Simplified CWG Block Diagram
- FIGURE 24-2: Typical CWG Operation with PWM1 (no Auto-shutdown)
- 24.1 Fundamental Operation
- 24.2 Clock Source
- 24.3 Selectable Input Sources
- 24.4 Output Control
- 24.5 Dead-Band Control
- 24.6 Rising Edge Dead Band
- 24.7 Falling Edge Dead Band
- 24.8 Dead-Band Uncertainty
- 24.9 Auto-shutdown Control
- 24.10 Operation During Sleep
- 24.11 Alternate Pin Locations
- 24.12 Configuring the CWG
- 24.13 CWG Control Registers
- Register 24-1: CWGxCON0: CWG Control Register 0
- Register 24-2: CWGxCON1: CWG Control Register 1
- Register 24-3: CWGXCON2: CWG Control Register 2
- Register 24-4: CWGxDBR: Complementary Waveform Generator (CWGx) Rising Dead-band Count Register
- Register 24-5: CWGxdbf: Complementary Waveform Generator (CWGx) Falling Dead-Band Count Register
- 24.13.1 Alternate Pin Locations
- 25.0 In-Circuit Serial Programming™ (ICSP™)
- 26.0 Instruction Set Summary
- 27.0 Electrical Specifications
- Absolute Maximum Ratings(†)
- 27.1 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
- 27.2 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down)
- 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) (Continued)
- 27.4 DC Characteristics: PIC12(L)F1501-I/E
- 27.5 Memory Programming Requirements
- 27.6 Thermal Considerations
- 27.7 Timing Parameter Symbology
- 27.8 AC Characteristics: PIC12(L)F1501-I/E
- FIGURE 27-5: Clock Timing
- TABLE 27-1: Clock Oscillator Timing Requirements
- TABLE 27-2: Oscillator Parameters
- FIGURE 27-6: CLKOUT and I/O Timing
- TABLE 27-3: CLKOUT and I/O Timing Parameters
- FIGURE 27-7: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 27-8: Brown-Out Reset Timing and Characteristics
- TABLE 27-4: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-Out Reset Parameters
- FIGURE 27-9: Timer0 and Timer1 External Clock Timings
- TABLE 27-5: Timer0 and Timer1 External Clock Requirements
- TABLE 27-6: PIC12(L)F1501 A/D Converter (ADC) Characteristics:
- TABLE 27-7: PIC12(L)F1501 A/D Conversion Requirements
- FIGURE 27-10: PIC12(L)F1501 A/D Conversion Timing (Normal Mode)
- FIGURE 27-11: PIC12(L)F1501 A/D Conversion Timing (Sleep Mode)
- TABLE 27-8: Comparator Specifications
- TABLE 27-9: Digital-to-Analog Converter (DAC) Specifications
- 28.0 DC and AC Characteristics Graphs and Charts
- 30.0 Packaging Information
- Appendix A: Data Sheet Revision History
- INDEX
- Product Identification System
- Worldwide Sales and Service

2011 Microchip Technology Inc. Preliminary DS41615A-page 111
PIC12(L)F1501
14.0 TEMPERATURE INDICATOR
MODULE
This family of devices is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit’s range of operating
temperature falls between -40°C and +85°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
The circuit may be used as a temperature threshold
detector or a more accurate temperature indicator,
depending on the level of calibration performed. A one-
point calibration allows the circuit to indicate a
temperature closely surrounding that point. A two-point
calibration allows the circuit to sense the entire range
of temperature more accurately. Reference Application
Note AN1333, “
Use and Calibration of the Internal
Temperature Indicator
” (DS01333) for more details
regarding the calibration process.
14.1 Circuit Operation
Figure 14-1 shows a simplified block diagram of the
temperature circuit. The proportional voltage output is
achieved by measuring the forward voltage drop across
multiple silicon junctions.
Equation 14-1 describes the output characteristics of
the temperature indicator.
EQUATION 14-1: VOUT RANGES
The temperature sense circuit is integrated with the
Fixed Voltage Reference (FVR) module. See
Section 13.0 “Fixed Voltage Reference (FVR)” for
more information.
The circuit is enabled by setting the TSEN bit of the
FVRCON register. When disabled, the circuit draws no
current.
The circuit operates in either high or low range. The high
range, selected by setting the TSRNG bit of the
FVRCON register, provides a wider output voltage. This
provides more resolution over the temperature range,
but may be less consistent from part to part. This range
requires a higher bias voltage to operate and thus, a
higher V
DD is needed.
The low range is selected by clearing the TSRNG bit of
the FVRCON register. The low range generates a lower
voltage drop and thus, a lower bias voltage is needed to
operate the circuit. The low range is provided for low
voltage operation.
FIGURE 14-1: TEMPERATURE CIRCUIT
DIAGRAM
14.2 Minimum Operating VDD
When the temperature circuit is operated in low range,
the device may be operated at any operating voltage
that is within specifications.
When the temperature circuit is operated in high range,
the device operating voltage, V
DD, must be high
enough to ensure that the temperature circuit is cor-
rectly biased.
Table 14-1 shows the recommended minimum V
DD vs.
range setting.
TABLE 14-1: RECOMMENDED VDD VS.
RANGE
14.3 Temperature Output
The output of the circuit is measured using the internal
Analog-to-Digital Converter. A channel is reserved for
the temperature circuit output. Refer to
Section 15.0
“Analog-to-Digital Converter (ADC) Module”
for
detailed information.
14.4 ADC Acquisition Time
To ensure accurate temperature measurements, the
user must wait at least 200
s after the ADC input
multiplexer is connected to the temperature indicator
output before the conversion is performed. In addition,
the user must wait 200
s between sequential
conversions of the temperature indicator output.
High Range: VOUT = VDD - 4VT
Low Range: VOUT = VDD - 2VT
Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0
3.6V 1.8V
TSEN
TSRNG
VDD
VOUT
To A D C