Datasheet

PIC12C67X
DS30561C-page 118  1997-2013 Microchip Technology Inc.
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
7.116.866.60.280.270.260ULid Width
11.6811.4311.18.460.450.440TLid Length
4.344.224.09.171.166.161WWindow Diameter
8.237.877.52.324.310.296eBOverall Row Spacing
0.510.460.41.020.018.016BLower Lead Width
1.521.401.27.060.055.050B1Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.813.563.30.150.140.130LTip to Seating Plane
13.4613.2112.95.530.520.510DOverall Length
7.627.377.11.300.290.280E1Package Width
1.140.890.64.045.035.025A1Standoff
3.633.122.62.143.123.103
A2
Top of Body to Seating Plane
4.704.193.68.185.165
.145ATop to Seating Plane
2.54.100
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
T
E1
U
W
c
eB
L
A2
B
B1
A
A1
p
*Controlling Parameter
JEDC Equivalent: MS-015
Drawing No. C04-083
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging