Datasheet

 1997-2013 Microchip Technology Inc. DS30561C-page 93
PIC12C67X
LP Oscillator Operating
Frequency
INTRC/EXTRC Oscillator
Operating Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
FOSC 0
—
0
0
200
4
(6)
4
10
kHz
MHz
MHz
MHz
All temperatures
All temperatures
All temperatures
All temperatures
* These parameters are characterized but not tested.
Note 1: Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not
tested.
2: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator
type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption.
a) The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to V
SS, T0CKI = VDD,
MCLR
= VDD; WDT disabled.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
4: For EXTRC osc configuration, current through R
EXT is not included. The current through the resistor can be estimated by the
formula:
Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS.
6: INTRC calibration value is for 4MHz nominal at 5V, 25°C.
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0°C  T
A  +70°C (commercial)
–40°C  T
A  +85°C (industrial)
–40°C  T
A  +125°C (extended)
Parm
No.
Characteristic Sym Min
Typ
(1)
Max Units Conditions